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MC14598BCPG

Onsemi

MC14598BCPG by Onsemi

MC14598BCPG by Onsemi is an 8-bit latch with 160ns propagation delay, operating at 5V. It features a 3-STATE output and HIGH LEVEL trigger type, suitable for MILITARY applications. With a package size of 22.73mm x 7.62mm x 4.57mm, it has through-hole terminals and can handle up to 18V supply voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 1,301 parts In-Stock

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AZTECH Wire

Italy . 927 parts In-Stock

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TANS Electronics

Latvia . 7,948 parts In-Stock

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SupplyDigital Components

Austria . 6,971 parts In-Stock

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Microchip USA

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Problanco Electronics

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Corphita

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 706 parts In-Stock

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Corohmni

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Overview

Unlock endless possibilities with the MC14598BCPG by Onsemi. This high-quality latch & flip-flop device offers reliable performance and precision, perfect for a wide range of applications. With a nominal supply voltage of 5V and a fast propagation delay of 160ns, this product delivers exceptional value and efficiency. Whether you're in the military, industrial, or automotive sector, the MC14598BCPG is your go-to solution for seamless operation and superior functionality. Trust Onsemi for top-notch technology and innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to environmental factors, making the latch or flip-flop reliable for long-term use.

Propagation Delay At Nominal Supply: 160 ns

Low propagation delay ensures fast response time, making the latch or flip-flop suitable for high-speed applications.

No. of Bits: 8

8 bits allow for versatile data storage and processing capabilities, making the latch or flip-flop suitable for various digital signal processing tasks.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common 5V supply voltage, making it compatible with many standard digital systems.

Output Characteristics: 3-STATE

3-state output allows the latch or flip-flop to control multiple output devices, enhancing its versatility in digital circuit design.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliable operation in harsh environments and critical applications where temperature fluctuations may occur.

Technical Specifications

Latches & Flip-Flops MC14598BCPG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e3

Length:

22.73 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

1.2 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

160 ns

Propagation Delay (tpd):

320 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

HIGH LEVEL

Width:

7.62 mm

Trade Compliance

MC14598BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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