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MC1413DR2

Onsemi

MC1413DR2 by Onsemi

MC1413DR2 by Onsemi is a NPN BJT transistor for switching applications. It has hFE of 1000, VCE of 50V, and IC of 0.5A. The package is small outline with Gull Wing terminals, suitable for surface mount technology.

Median Price

$0.439

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 200 parts In-Stock

1+ parts

$2.071

100+ parts

$1.885

1k+ parts

$1.698

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200

$2.071

$1.885

$1.698

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Flip Electronics (Authorized)

USA . 38,814 parts In-Stock

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Rochester

USA . 4,046 parts In-Stock

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$0.383

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$0.318

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$0.283

4,046

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$0.383

$0.318

$0.283

DigiKey

USA . 4,046 parts In-Stock

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$0.480

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4,046

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$0.480

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Verical

USA . 2,525 parts In-Stock

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$0.398

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$0.354

2,525

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$0.398

$0.354

Distributors (In-Stock)

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Digiode

USA . 1,585 parts In-Stock

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$0.298

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Flip Electronics

USA . 38,814 parts In-Stock

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Vyrian

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Chip Stock

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Bristol Electronics

USA . 10,489 parts In-Stock

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Atlantic Semiconductor

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Sunrise Surplus Inc.

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Fibra_Brandt Electronic GMBH

Germany . 2,400 parts In-Stock

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Inventory MP

USA . 2,029 parts In-Stock

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A2Z Electronics, Inc.

USA . 1,300 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

USA . 1,210 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 1,150 parts In-Stock

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Mil-Aero Solutions, Inc.

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PC Components Company LLC

USA . 873 parts In-Stock

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873

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ComSIT Distribution GmbH

Germany . 594 parts In-Stock

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594

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Elcom Components

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Electronic Expediters

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500

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ACDS - Activité Composants Distribution Service

France . 406 parts In-Stock

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Dan-Mar Components

USA . 406 parts In-Stock

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ECAB

Sweden . 253 parts In-Stock

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LWI Electronics Inc

India . 155 parts In-Stock

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Semtec, LLC

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Nova Conductors

Japan . 69 parts In-Stock

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MRC Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 11,462 parts In-Stock

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$0.267

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Corphita

USA . 2,492 parts In-Stock

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$0.283

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Corohmni

South Africa . 377 parts In-Stock

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$0.314

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377

$0.314

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Component Stockers USA

USA . 4,056 parts In-Stock

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$0.320

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$0.300

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$0.280

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4,056

$0.320

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$0.280

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$2.071

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$1.885

1k+ parts

$1.698

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200

$2.071

$1.885

$1.698

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QUARKTWIN TECHNOLOGY LTD

USA . 18,713 parts In-Stock

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TANS Electronics

Latvia . 7,707 parts In-Stock

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Problanco Electronics

Mexico . 5,008 parts In-Stock

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Metaverse IC Inc.

Canada . 4,900 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,721 parts In-Stock

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Continental Prestige Electronics

USA . 4,046 parts In-Stock

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SupplyDigital Components

Austria . 3,502 parts In-Stock

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Kulean Microsystems

USA . 3,352 parts In-Stock

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Perfect Parts

USA . 3,252 parts In-Stock

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Argo Parts USA

USA . 1,967 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,763 parts In-Stock

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Kepictronics

USA . 792 parts In-Stock

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UHIMA Technologies

Türkiye . 765 parts In-Stock

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Infinite Electronics LLP (Excess)

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unlock the power of efficient switching with the MC1413DR2 from Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Power Bipolar Junction Transistors for a wide range of applications. This NPN transistor offers customers unparalleled value with its high DC current gain and maximum collector current capabilities. Whether you're designing for industrial automation or consumer electronics, the MC1413DR2 provides the reliability and performance you need to bring your projects to life. Trust Onsemi to deliver innovative solutions for all your transistor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, making it durable and long-lasting.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplification and switching applications, providing reliable performance.

Configuration: COMPLEX

The complex configuration allows for versatility in circuit design, enabling the transistor to be used in a variety of applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast and efficient switching capabilities.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to handle and mount, ensuring a secure fit within the circuit.

No. of Elements: 7

This transistor contains multiple elements, providing enhanced functionality for complex circuit requirements.

No. of Terminals: 16

With a high number of terminals, this transistor offers increased connectivity options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for high-density mounting on circuit boards.

Minimum DC Current Gain (hFE): 1000

The high DC current gain ensures efficient amplification and switching capabilities, making the transistor highly reliable.

Maximum Collector-Emitter Voltage: 50 V

With a high maximum voltage rating, this transistor can handle a wide range of operating conditions, increasing its versatility.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, ensuring stable and consistent performance.

Maximum Collector Current (IC): 0.5 A

The high maximum collector current rating allows for efficient power handling and switching capabilities in various applications.

Terminal Finish: TIN LEAD

The tin lead finish provides good solderability and ensures reliable electrical connections, making the transistor easy to integrate into circuits.

Terminal Position: DUAL

Dual terminal positions provide flexibility in mounting and wiring options, accommodating different circuit layouts.

Peak Reflow Temperature °C: 235

The high peak reflow temperature allows for reliable soldering processes without damaging the transistor, ensuring long-term performance.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MC1413DR2 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Configuration:

Minimum DC Current Gain (hFE):

1000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

7

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MC1413DR2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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