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MC10H334FNG

Onsemi

MC10H334FNG by Onsemi

MC10H334FNG by Onsemi is a 4-bit bus driver with propagation delay of 2.7 ns, suitable for ECL technology applications. It features open-emitter output polarity and operates in temperature range of 0-75 °C. This chip carrier package has 20 terminals and is surface mountable, making it ideal for high-speed communication systems.

Median Price

$13.455

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,252 parts In-Stock

1+ parts

-

100+ parts

$11.960

1k+ parts

$10.700

10k+ parts

$10.070

1,252

-

$11.960

$10.700

$10.070

Verical

USA . 1,252 parts In-Stock

1+ parts

-

100+ parts

$14.950

1k+ parts

$13.375

10k+ parts

$12.588

1,252

-

$14.950

$13.375

$12.588

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,180 parts In-Stock

1+ parts

$12.664

100+ parts

-

1k+ parts

-

10k+ parts

-

2,180

$12.664

-

-

-

Vyrian

USA . 2,692 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,692

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 292 parts In-Stock

1+ parts

$11.700

100+ parts

-

1k+ parts

-

10k+ parts

-

292

$11.700

-

-

-

Corphita

USA . 630 parts In-Stock

1+ parts

$11.997

100+ parts

-

1k+ parts

-

10k+ parts

-

630

$11.997

-

-

-

AZTECH Wire

Italy . 620 parts In-Stock

1+ parts

$20.030

100+ parts

-

1k+ parts

-

10k+ parts

-

620

$20.030

-

-

-

SupplyDigital Components

Austria . 4,699 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,699

-

-

-

-

Problanco Electronics

Mexico . 4,433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,433

-

-

-

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Kulean Microsystems

USA . 3,321 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,321

-

-

-

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TANS Electronics

Latvia . 3,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,262

-

-

-

-

Continental Prestige Electronics

USA . 1,252 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,252

-

-

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UHIMA Technologies

Türkiye . 543 parts In-Stock

1+ parts

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100+ parts

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543

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Microchip USA

USA . 329 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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329

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Overview

Experience seamless data transmission and reliable performance with the MC10H334FNG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and innovation in their products. This bus driver & transceiver is perfect for a wide range of applications, offering fast propagation delay, open-emitter output characteristics, and independent control. With its compact chip carrier package and true output polarity, this product ensures optimal functionality while providing customers with unmatched value and efficiency. Upgrade your system with the MC10H334FNG and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, making it ideal for use in various applications without adding unnecessary weight.

Propagation Delay At Nominal Supply: 3.8 ns

With a low propagation delay at nominal supply, this product ensures quick and efficient signal transmission, which is crucial in bus driver and transceiver applications.

Surface Mount: YES

Being surface mountable makes installation and integration of this product easier and more convenient, while also saving space on the PCB.

No. of Bits: 4

Having 4 bits allows for efficient data transmission and processing, making this product suitable for handling multiple data streams simultaneously.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliability and longevity.

Technology: ECL

Employing ECL technology provides high-speed performance and low power consumption, making this product suitable for demanding bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers MC10H334FNG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER WITH CUT-OFF

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

161 mA

Propagation Delay At Nominal Supply:

3.8 ns

Propagation Delay (tpd):

2.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

8.965 mm

Trade Compliance

MC10H334FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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