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MC10H210MG

Onsemi

MC10H210MG by Onsemi

MC10H210MG by Onsemi is a Logic Gates IC with 2 functions and 3 inputs. It has a fast propagation delay of 1.7 ns at -5.2V, making it suitable for high-speed applications in commercial electronics. The small outline package with gull wing terminals and surface mount capability enhances ease of integration into circuit designs.

Median Price

$4.488

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,793 parts In-Stock

1+ parts

-

100+ parts

$3.990

1k+ parts

$3.570

10k+ parts

$3.360

5,793

-

$3.990

$3.570

$3.360

Verical

USA . 5,793 parts In-Stock

1+ parts

-

100+ parts

$4.987

1k+ parts

$4.463

10k+ parts

$4.200

5,793

-

$4.987

$4.463

$4.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 550 parts In-Stock

1+ parts

$4.218

100+ parts

-

1k+ parts

-

10k+ parts

-

550

$4.218

-

-

-

Vyrian

USA . 7,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,723

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 222 parts In-Stock

1+ parts

$3.900

100+ parts

-

1k+ parts

-

10k+ parts

-

222

$3.900

-

-

-

Corphita

USA . 386 parts In-Stock

1+ parts

$3.996

100+ parts

-

1k+ parts

-

10k+ parts

-

386

$3.996

-

-

-

AZTECH Wire

Italy . 699 parts In-Stock

1+ parts

$18.830

100+ parts

-

1k+ parts

-

10k+ parts

-

699

$18.830

-

-

-

SupplyDigital Components

Austria . 8,400 parts In-Stock

1+ parts

-

100+ parts

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-

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8,400

-

-

-

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Continental Prestige Electronics

USA . 5,793 parts In-Stock

1+ parts

-

100+ parts

$3.930

1k+ parts

-

10k+ parts

-

5,793

-

$3.930

-

-

Kepictronics

USA . 4,050 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,050

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-

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TANS Electronics

Latvia . 3,937 parts In-Stock

1+ parts

-

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3,937

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-

-

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Kulean Microsystems

USA . 1,869 parts In-Stock

1+ parts

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1,869

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Microchip USA

USA . 413 parts In-Stock

1+ parts

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413

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UHIMA Technologies

Türkiye . 281 parts In-Stock

1+ parts

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100+ parts

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281

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Problanco Electronics

Mexico . 177 parts In-Stock

1+ parts

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100+ parts

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177

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Overview

Elevate your logic gate game with the MC10H210MG by Onsemi. Crafted from high-quality plastic/epoxy materials, this small outline package houses two functions and three inputs, delivering lightning-fast 1.7 ns propagation delay. Ideal for commercial extended temperature applications, this ECL technology marvel boasts a dual terminal position and nickel palladium gold finish for top-notch performance. Embrace the power of seamless integration with surface mount capabilities and a compact rectangular shape, making it a versatile choice for your electronic projects. Trust in Onsemi's renowned expertise to bring you reliability and innovation in every component, elevating your designs to new heights of efficiency and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for compact electronic devices.

Propagation Delay At Nominal Supply: 1.7 ns

With a low propagation delay, this logic gate operates efficiently and quickly, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

No. of Functions: 2

This logic gate performs two functions, increasing its versatility and functionality in electronic circuits.

No. of Inputs: 3

Having three inputs allows for more complex logic operations to be performed, making this gate suitable for advanced applications.

Nominal Supply Voltage / Vsup (V): -5.2

The nominal supply voltage of -5.2 volts ensures reliable operation within specified voltage range, making it compatible with standard power sources.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, ideal for compact electronic devices with limited real estate.

Maximum Operating Temperature: 75 °C

With a high operating temperature range of 0 to 75 °C, this logic gate can withstand varying environmental conditions, enhancing its reliability.

Technology: ECL

Using ECL technology offers high-speed operation and low power consumption, making it suitable for applications requiring fast switching speeds and low energy consumption.

Technical Specifications

Logic Gates MC10H210MG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Inputs:

3

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1.7 ns

Propagation Delay (tpd):

1.55 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H210MG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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