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MC10H188FNR2G

Onsemi

MC10H188FNR2G by Onsemi

MC10H188FNR2G by Onsemi is a Logic Gates chip with 6 functions, 1.9 ns propagation delay, and -5.2V nominal voltage. Ideal for applications requiring fast signal processing in commercial extended temperature environments.

Median Price

$7.808

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,842 parts In-Stock

1+ parts

-

100+ parts

$6.940

1k+ parts

$6.210

10k+ parts

$5.840

8,842

-

$6.940

$6.210

$5.840

Verical

USA . 7,842 parts In-Stock

1+ parts

-

100+ parts

$8.675

1k+ parts

$7.763

10k+ parts

$7.300

7,842

-

$8.675

$7.763

$7.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,396 parts In-Stock

1+ parts

$7.334

100+ parts

-

1k+ parts

-

10k+ parts

-

2,396

$7.334

-

-

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Vyrian

USA . 5,695 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,695

-

-

-

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Bristol Electronics

USA . 160 parts In-Stock

1+ parts

-

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160

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 900 parts In-Stock

1+ parts

$6.948

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$6.948

-

-

-

Corohmni

South Africa . 129 parts In-Stock

1+ parts

$7.380

100+ parts

-

1k+ parts

-

10k+ parts

-

129

$7.380

-

-

-

Component Stockers USA

USA . 5,411 parts In-Stock

1+ parts

$7.830

100+ parts

$7.360

1k+ parts

$6.650

10k+ parts

-

5,411

$7.830

$7.360

$6.650

-

AZTECH Wire

Italy . 577 parts In-Stock

1+ parts

$19.290

100+ parts

-

1k+ parts

-

10k+ parts

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577

$19.290

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 19,638 parts In-Stock

1+ parts

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100+ parts

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19,638

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Continental Prestige Electronics

USA . 8,842 parts In-Stock

1+ parts

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100+ parts

$6.560

1k+ parts

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8,842

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$6.560

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Kulean Microsystems

USA . 7,406 parts In-Stock

1+ parts

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7,406

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SupplyDigital Components

Austria . 3,064 parts In-Stock

1+ parts

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3,064

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TANS Electronics

Latvia . 1,693 parts In-Stock

1+ parts

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100+ parts

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1,693

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Problanco Electronics

Mexico . 1,292 parts In-Stock

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1,292

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Microchip USA

USA . 365 parts In-Stock

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365

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UHIMA Technologies

Türkiye . 29 parts In-Stock

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29

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Overview

Discover the MC10H188FNR2G by Onsemi, a top-quality logic gate that offers unparalleled performance and reliability. With a range of applications in various industries, this product is a must-have for any project requiring fast propagation delay and inverted output polarity. Onsemi, known for its cutting-edge technology, ensures that customers receive a high-value solution that exceeds expectations. Experience the benefits of this chip carrier package with 6 functions, enabling seamless integration and optimal functionality. Upgrade your designs with the MC10H188FNR2G and unlock endless possibilities for innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for handling and transporting the logic gates.

Propagation Delay At Nominal Supply: 2.2 ns

The low propagation delay ensures fast processing of signals, making this product suitable for applications requiring quick response times.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and making assembly simpler.

No. of Functions: 6

Having multiple functions in one chip offers versatility and efficiency in circuit design, reducing the need for additional components.

Package Shape: SQUARE

The square package shape helps optimize space utilization on the circuit board, especially when dealing with limited space constraints.

No. of Bits: 6

With 6 bits, this logic gate chip can handle a range of binary operations effectively, making it suitable for various digital logic applications.

Nominal Supply Voltage / Vsup (V): -5.2

The specified supply voltage ensures stable and reliable operation of the logic gates within the recommended voltage range.

No. of Terminals: 20

Having 20 terminals provides flexibility in connectivity options and enables complex circuit configurations to be implemented.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good heat dissipation and mechanical protection for the internal components, ensuring long-term performance.

Propagation Delay (tpd): 1.9 ns

The even lower propagation delay compared to the nominal supply delay further enhances the speed and efficiency of signal processing in applications.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, this logic gate chip can withstand demanding environmental conditions, increasing its reliability.

Minimum Operating Temperature: 0 °C

The wide temperature range allows for operation in various temperature environments, making this product suitable for diverse applications.

Terminal Finish: TIN

The use of tin terminal finish ensures good solderability and electrical conductivity, contributing to the overall reliability of the product.

Terminal Position: QUAD

The quad terminal position provides good mechanical stability and ease of connection, making installation and maintenance simpler.

Maximum Seated Height: 4.57 mm

The low seated height of the package allows for compact design layouts and reduces the overall profile of the circuit board assembly.

Width: 8.965 mm

The specified width provides a compact form factor, enabling space-efficient integration of the logic gates into electronic systems.

Output Polarity: INVERTED

Having inverted output polarity offers flexibility in signal processing and allows for compatibility with a wide range of interfacing devices.

Minimum Supply Voltage (Vsup): -4.94 V

The specified minimum supply voltage ensures proper operation even under low-voltage conditions, enhancing the product's reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes this product suitable for reflow soldering processes, ensuring reliable and robust solder joints.

Length: 8.965 mm

The specified length complements the width to form a compact package size, making the logic gates suitable for space-constrained applications.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures reliable operation in a wide range of temperature conditions, making this product versatile for different environments.

Technology: ECL

The ECL technology used in these logic gates offers high-speed operation and low power consumption, making them suitable for high-performance applications.

Terminal Form: J BEND

The J bend terminal form provides mechanical stability and ease of insertion during assembly, ensuring secure connections and simplifying installation.

Packing Method: TR

The TR packing method ensures safe transport and storage of the logic gates, protecting them from damage and maintaining their quality.

Terminal Pitch: 1.27 mm

The specified terminal pitch allows for easy and precise mounting on circuit boards, simplifying the assembly process and ensuring accurate connections.

Control Type: ENABLE HIGH

The enable high control type offers flexibility in signal processing and allows for customizable logic operations, enhancing the versatility of the product.

Maximum Supply Voltage (Vsup): -5.46 V

The specified maximum supply voltage ensures protection against voltage spikes and overvoltage conditions, safeguarding the logic gates from damage.

Maximum Power Supply Current (ICC): 46 mA

With a maximum power supply current of 46 mA, this product offers efficient power consumption and helps optimize energy usage in electronic systems.

Technical Specifications

Logic Gates MC10H188FNR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

No. of Bits:

6

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

46 mA

Propagation Delay At Nominal Supply:

2.2 ns

Propagation Delay (tpd):

1.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10H188FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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