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MC10H103M

Onsemi

MC10H103M by Onsemi

MC10H103M by Onsemi is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 1.3 ns at -5.2V, making it ideal for high-speed applications in commercial electronics. The small outline package with gull wing terminals ensures easy surface mount installation for efficient circuit design.

Median Price

$1.410

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 139 parts In-Stock

1+ parts

-

100+ parts

$1.410

1k+ parts

$1.260

10k+ parts

$1.180

139

-

$1.410

$1.260

$1.180

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 387 parts In-Stock

1+ parts

$1.482

100+ parts

-

1k+ parts

-

10k+ parts

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387

$1.482

-

-

-

Vyrian

USA . 3,188 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,188

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,057 parts In-Stock

1+ parts

$1.404

100+ parts

-

1k+ parts

-

10k+ parts

-

1,057

$1.404

-

-

-

Corohmni

South Africa . 439 parts In-Stock

1+ parts

$1.560

100+ parts

-

1k+ parts

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-

439

$1.560

-

-

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AZTECH Wire

Italy . 1,180 parts In-Stock

1+ parts

$8.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,180

$8.900

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$32.561

100+ parts

$29.631

1k+ parts

$26.700

10k+ parts

-

500

$32.561

$29.631

$26.700

-

Problanco Electronics

Mexico . 8,327 parts In-Stock

1+ parts

-

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8,327

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Kulean Microsystems

USA . 5,501 parts In-Stock

1+ parts

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5,501

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SupplyDigital Components

Austria . 5,157 parts In-Stock

1+ parts

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5,157

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TANS Electronics

Latvia . 2,981 parts In-Stock

1+ parts

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2,981

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UHIMA Technologies

Türkiye . 485 parts In-Stock

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485

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Microchip USA

USA . 354 parts In-Stock

1+ parts

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354

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Discover the power of efficiency and reliability with the MC10H103M by Onsemi. As a trusted manufacturer in the industry, Onsemi brings you a high-quality logic gate that is perfect for a wide range of applications. With fast propagation delays and a durable package body material, this product offers unparalleled performance and precision. Whether you're looking to enhance your communication systems or streamline your data processing, the MC10H103M delivers value, benefits, and advantages that will exceed your expectations. Upgrade your projects with confidence and experience seamless operation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, this logic gate is lightweight and durable, making it easy to handle and long-lasting.

Propagation Delay At Nominal Supply: 1.45 ns

With a fast propagation delay, this logic gate ensures quick signal processing, making it suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient integration onto circuit boards, saving space and increasing efficiency.

No. of Functions: 4

This logic gate can perform multiple functions, offering versatility and flexibility in circuit design.

No. of Inputs: 2

With two input ports, this logic gate can accept multiple signals, enabling complex logical operations.

Package Shape: RECTANGULAR

The rectangular package shape provides a standard form factor, ensuring compatibility with various circuit designs and layouts.

Nominal Supply Voltage / Vsup (V): -5.2

Operating at -5.2 volts, this logic gate is suitable for low-power applications, helping to conserve energy.

No. of Terminals: 16

With 16 terminals, this logic gate offers ample connectivity options for interfacing with other circuit components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact electronic devices.

Propagation Delay (tpd): 1.3 ns

The low propagation delay of 1.3 ns ensures fast signal processing and high-speed operation, suitable for time-critical applications.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75 °C, this logic gate can withstand moderate heat levels, ensuring reliable performance in various environments.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0 °C, this logic gate is suitable for use in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for enhanced performance.

Terminal Position: DUAL

With dual terminal positions, this logic gate offers flexibility in circuit board layout and installation, accommodating various design requirements.

Maximum Seated Height: 2.05 mm

The maximum seated height of 2.05 mm allows for low-profile mounting, saving space in compact electronic devices.

Width: 5.275 mm

The width of 5.275 mm provides a compact form factor, suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): -4.94 V

With a minimum supply voltage of -4.94 volts, this logic gate can operate efficiently even at lower power levels, conserving energy.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C allows for reliable soldering during the manufacturing process, ensuring secure connections.

Length: 10.2 mm

The length of 10.2 mm provides a compact footprint, making this logic gate suitable for space-constrained applications.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures reliable performance in a wide range of temperature conditions, making this logic gate versatile and adaptable.

Technology: ECL

Utilizing ECL (Emitter-Coupled Logic) technology, this logic gate offers high-speed operation and low power consumption, making it ideal for performance-critical applications.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy surface mounting onto circuit boards, enhancing efficiency and simplifying installation.

Packing Method: RAIL

The rail packing method facilitates handling and transportation, ensuring that the logic gates are securely packaged and organized for easy assembly.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this logic gate offers precise and reliable connections, enhancing signal integrity and performance.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this logic gate can withstand moderate exposure to moisture during storage and assembly, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): -5.46 V

Operating at a maximum supply voltage of -5.46 volts, this logic gate offers a wide voltage range, accommodating different power supply requirements.

Technical Specifications

Logic Gates MC10H103M attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1.45 ns

Propagation Delay (tpd):

1.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H103M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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