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MC10EP196FAR2

Onsemi

MC10EP196FAR2 by Onsemi

MC10EP196FAR2 by Onsemi is a delay line with 1023 taps, total delay of 12.2ns, and ECL technology. It operates in industrial temperature range and has a supply voltage range of +-3.3/+-5V. This programmable device in a flatpack package is suitable for high-speed communication applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,433 parts In-Stock

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Vyrian

USA . 1,668 parts In-Stock

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1,668

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Distributors (Availability)

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Problanco Electronics

Mexico . 7,586 parts In-Stock

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TANS Electronics

Latvia . 2,713 parts In-Stock

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Kulean Microsystems

USA . 2,224 parts In-Stock

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SupplyDigital Components

Austria . 1,127 parts In-Stock

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UHIMA Technologies

Türkiye . 642 parts In-Stock

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642

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Corphita

USA . 445 parts In-Stock

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Corohmni

South Africa . 398 parts In-Stock

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Overview

Unlock the power of precise signal delays with the MC10EP196FAR2 by Onsemi. Crafted with top-tier quality and cutting-edge technology, this delay line offers unparalleled accuracy and reliability in a compact square package. Ideal for a wide range of applications, this product delivers exceptional performance and value to customers seeking superior signal processing solutions. Experience the benefits of Onsemi's expertise and innovation with the MC10EP196FAR2 - your gateway to enhanced communication and control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the delay line lightweight and durable, ideal for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage of 3.3V, ensuring compatibility with many systems.

No. of Terminals: 32

Provides a sufficient number of terminals for connectivity and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

Width: 7 mm

Compact width allows for space-efficient placement on a circuit board.

Nominal Total Delay (td): 12.2 ns

Offers precise control over delay time, crucial for timing-sensitive applications.

Technology: ECL

Utilizes ECL technology known for its high-speed performance, making it suitable for high-frequency applications.

Programmable Delay Line: YES

Being programmable allows for customizable delay settings, offering versatility in use.

Technical Specifications

Delay Lines MC10EP196FAR2 attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE=-3.0 V TO -5.5 V

Family:

10E

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e0

Length:

7 mm

Logic IC Type:

No. of Functions:

1

No. of Taps/Steps:

1023

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

+-3.3/+-5

Programmable Delay Line:

YES

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Nominal Total Delay (td):

12.2 ns

Width:

7 mm

Trade Compliance

MC10EP196FAR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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