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MC100E195FNR2

Onsemi

MC100E195FNR2 by Onsemi

MC100E195FNR2 by Onsemi is a delay line with 4.72ns propagation delay at 5V, ECL technology, and 127 taps/steps. It is used in applications requiring precise timing control like telecommunications and networking systems.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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ACDS - Activité Composants Distribution Service

France . 11,468 parts In-Stock

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Digiode

USA . 1,780 parts In-Stock

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Inventory MP

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Bristol Electronics

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Component Stockers USA

USA . 364 parts In-Stock

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$99.990

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 11,898 parts In-Stock

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TANS Electronics

Latvia . 2,725 parts In-Stock

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Corphita

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SupplyDigital Components

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Problanco Electronics

Mexico . 1,943 parts In-Stock

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Kulean Microsystems

USA . 1,463 parts In-Stock

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Corohmni

South Africa . 452 parts In-Stock

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UHIMA Technologies

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Microchip USA

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Overview

Upgrade your electronic projects with the MC100E195FNR2 from Onsemi, a high-quality delay line that offers precision and reliability. Designed by a trusted manufacturer, this chip carrier package provides a nominal total delay of 3.63 ns and features 127 taps/steps for versatile applications. With a programmable delay line and complementary output polarity, this product is perfect for demanding tasks where timing accuracy is crucial. Trust Onsemi to deliver exceptional performance and value with the MC100E195FNR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 4.72 ns

Fast propagation delay ensures quick signal processing, making this delay line suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with most electronic systems.

No. of Terminals: 28

Having 28 terminals provides flexibility in connecting to other components, increasing versatility in system design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this delay line can withstand harsh environmental conditions.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies signal processing and integration with other circuitry.

Minimum Supply Voltage (Vsup): 4.2 V

Low minimum supply voltage allows for operation in low-power applications, increasing energy efficiency.

Technology: ECL

Utilizing ECL technology provides high-speed and low power consumption, making it suitable for demanding electronic systems.

Programmable Delay Line: YES

Being programmable allows for customization of delay times, catering to a variety of application requirements.

Technical Specifications

Delay Lines MC100E195FNR2 attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Taps/Steps:

127

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

156 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

4.72 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Nominal Total Delay (td):

3.63 ns

Width:

11.505 mm

Trade Compliance

MC100E195FNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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