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MC100EP195MNG

Onsemi

MC100EP195MNG by Onsemi

MC100EP195MNG by Onsemi is a delay line with 15.8ns propagation delay at 3.3V, ECL technology, and 1023 taps/steps. It has a programmable feature for precise timing control in industrial applications requiring high-speed signal synchronization. The chip carrier package with a very thin profile makes it suitable for compact designs where space is limited.

Median Price

$17.634

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 38 parts In-Stock

1+ parts

$17.780

100+ parts

$13.120

1k+ parts

-

10k+ parts

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38

$17.780

$13.120

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Mouser Electronics

USA . 110 parts In-Stock

1+ parts

$20.330

100+ parts

$14.020

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-

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110

$20.330

$14.020

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Chip1Stop

Japan . 53 parts In-Stock

1+ parts

$20.840

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53

$20.840

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DigiKey

USA . 11,207 parts In-Stock

1+ parts

-

100+ parts

$15.320

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11,207

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$15.320

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Rochester

USA . 4,278 parts In-Stock

1+ parts

-

100+ parts

$13.990

1k+ parts

$12.520

10k+ parts

$11.780

4,278

-

$13.990

$12.520

$11.780

Verical

USA . 2,471 parts In-Stock

1+ parts

-

100+ parts

$17.488

1k+ parts

$15.650

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2,471

-

$17.488

$15.650

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Flip Electronics (Authorized)

USA . 518 parts In-Stock

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518

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Distributors (In-Stock)

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Digiode

USA . 2,261 parts In-Stock

1+ parts

$14.801

100+ parts

-

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2,261

$14.801

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$14.810

100+ parts

-

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300

$14.810

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Vyrian

USA . 2,157 parts In-Stock

1+ parts

-

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2,157

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Flip Electronics

USA . 518 parts In-Stock

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518

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,175 parts In-Stock

1+ parts

$13.240

100+ parts

-

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2,175

$13.240

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Semicontronic

India . 1,902 parts In-Stock

1+ parts

$13.240

100+ parts

$12.909

1k+ parts

$12.843

10k+ parts

-

1,902

$13.240

$12.909

$12.843

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Corphita

USA . 1,430 parts In-Stock

1+ parts

$14.022

100+ parts

-

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1,430

$14.022

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Continental Prestige Electronics

USA . 6,626 parts In-Stock

1+ parts

$14.810

100+ parts

-

1k+ parts

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10k+ parts

$14.514

6,626

$14.810

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$14.514

Corohmni

South Africa . 262 parts In-Stock

1+ parts

$15.580

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262

$15.580

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Microchip USA

USA . 1,250 parts In-Stock

1+ parts

$52.790

100+ parts

$51.870

1k+ parts

$51.410

10k+ parts

$50.950

1,250

$52.790

$51.870

$51.410

$50.950

Problanco Electronics

Mexico . 8,130 parts In-Stock

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8,130

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SupplyDigital Components

Austria . 5,803 parts In-Stock

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Lixinc

USA . 2,989 parts In-Stock

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2,989

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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2,800

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TANS Electronics

Latvia . 1,696 parts In-Stock

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1,696

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Kulean Microsystems

USA . 1,623 parts In-Stock

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Perfect Parts

USA . 595 parts In-Stock

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595

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UHIMA Technologies

Türkiye . 230 parts In-Stock

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230

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Argo Parts USA

USA . 120 parts In-Stock

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120

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$14.514

1k+ parts

$14.070

10k+ parts

$13.773

100

-

$14.514

$14.070

$13.773

GreenTree Electronics

Israel . 51 parts In-Stock

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51

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Overview

Enhance your electronic projects with the MC100EP195MNG delay line by Onsemi! Crafted with precision and expertise, Onsemi delivers top-notch quality in the field of delay lines. This versatile component offers precise signal delay capabilities, making it perfect for applications in telecommunications, networking, and data communications. With its programmable features and industrial-grade technology, the MC100EP195MNG guarantees reliable performance and flexibility for your projects. Trust Onsemi to provide you with unmatched value and innovation in every product. Elevate your designs with the MC100EP195MNG and experience the difference that Onsemi brings to the table.

Feature Benefit Bullets

Propagation Delay At Nominal Supply

Low propagation delay ensures quick signal processing, making this product suitable for high-speed applications.

Surface Mount

Surface mounting capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Package Shape

Square package shape provides a compact footprint and efficient use of board space.

Nominal Supply Voltage / Vsup (V)

Operates at a common supply voltage of 3.3V, making it compatible with various systems and reducing the need for additional power conversion.

Power Supplies (V)

Accepts negative power supplies which can be useful in certain circuit configurations or voltage offset requirements.

No. of Terminals

Provides multiple terminals for versatile connectivity and interfacing with other components in the system.

Package Style (Meter)

Various package styles offer flexibility in design and thermal management options for different application requirements.

Maximum Operating Temperature

Can withstand high operating temperatures, ensuring reliable performance in harsh environmental conditions.

Minimum Operating Temperature

Ideal for use in a wide range of temperature environments, from cold to hot conditions.

Terminal Finish

Matte tin finish provides good solderability and corrosion resistance for reliable connections.

Terminal Position

Quad terminal layout enables efficient routing of signals and power within the component.

Maximum Seated Height

Low profile design with a maximum seated height of 1mm saves space and allows for compact system integration.

Width

Narrow width of 5mm enables dense packing on the circuit board and efficient use of available space.

Output Polarity

Complementary output polarity allows for differential signal processing and noise rejection in communication applications.

Minimum Supply Voltage (Vsup)

Works efficiently at low supply voltages, minimizing power consumption and enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s)

Withstands peak reflow temperatures for up to 30 seconds, ensuring reliable solder joints during assembly.

Peak Reflow Temperature °C

Can withstand high peak reflow temperatures during the soldering process without compromising performance.

Length

Compact length of 5mm allows for space-efficient placement on the PCB.

Temperature Grade

Industrial-grade temperature resistance ensures reliable operation in demanding industrial environments.

Nominal Total Delay (td)

Short total delay time of 12.2ns allows for precise timing control in signal processing applications.

No. of Taps/Steps

High number of taps/steps provides fine granularity in delay adjustments for accurate timing optimization.

Technology

Utilizes ECL technology known for high-speed operation and low jitter performance, making it suitable for critical timing applications.

Terminal Form

No lead terminal form offers environmental benefits and complies with RoHS regulations.

Programmable Delay Line

Programmable delay line feature allows for dynamic adjustment of delays, offering flexibility in system optimization.

Terminal Pitch

Fine terminal pitch of 0.5mm enables high-density mounting and precise connections on the PCB.

Maximum Supply Voltage (Vsup)

Supports a maximum supply voltage of 3.6V for enhanced compatibility with different power sources.

Maximum Power Supply Current (ICC)

Low power supply current consumption of 175mA reduces power losses and improves overall energy efficiency.

Technical Specifications

Delay Lines MC100EP195MNG attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE= -3.0V TO -3.6V

Family:

100E

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Taps/Steps:

1023

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

175 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

15.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Nominal Total Delay (td):

12.2 ns

Width:

5 mm

Trade Compliance

MC100EP195MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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