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MC100EP195BFAR2G

Onsemi

MC100EP195BFAR2G by Onsemi

MC100EP195BFAR2G by Onsemi is a delay line with 15.25ns propagation delay at 3.3V, featuring 1023 taps/steps and ECL technology. It is used in industrial applications for precise signal timing and synchronization requirements.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,720 parts In-Stock

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Digiode

USA . 1,670 parts In-Stock

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AZTECH Wire

Italy . 135 parts In-Stock

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$10.720

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Component Stockers USA

USA . 666 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 4,600 parts In-Stock

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TANS Electronics

Latvia . 3,019 parts In-Stock

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Kulean Microsystems

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 1,086 parts In-Stock

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UHIMA Technologies

Türkiye . 907 parts In-Stock

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Corphita

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Corohmni

South Africa . 403 parts In-Stock

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GreenTree Electronics

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Microchip USA

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Overview

Discover the cutting-edge MC100EP195BFAR2G by Onsemi, a top-tier manufacturer known for excellence in electronic components. As part of the Delay Lines category, this product offers precision timing solutions for a wide range of applications. With a nominal supply voltage of 3.3V and a total delay of 12.2ns, this programmable delay line boasts superior performance and reliability. Its compact design and ease of installation make it ideal for industrial use. Upgrade your projects with the MC100EP195BFAR2G and experience unmatched quality and value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring reliability for long-term use.

Propagation Delay At Nominal Supply: 15.25 ns

Offers precise delay timing, which is essential for various applications in signal processing and synchronization.

Surface Mount: YES

Facilitates easy and efficient installation, particularly in compact electronic devices.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage, making it compatible with a wide range of systems and components.

No. of Terminals: 32

Provides multiple connection points for versatile integration within a circuit or system.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under high-temperature conditions, suitable for industrial applications.

Technology: ECL

Utilizes Emitter-Coupled Logic technology, known for its high-speed operation and low power consumption.

Programmable Delay Line: YES

Allows for flexibility in adjusting delay times to meet specific requirements, enhancing the product's adaptability.

Technical Specifications

Delay Lines MC100EP195BFAR2G attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V

Family:

100E

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Taps/Steps:

1023

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

170 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

15.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Nominal Total Delay (td):

12.2 ns

Width:

7 mm

Trade Compliance

MC100EP195BFAR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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