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MC100EP195MNR4G

Onsemi

MC100EP195MNR4G by Onsemi

MC100EP195MNR4G by Onsemi is a delay line with 15.8ns propagation delay at 3.3V, featuring 1023 taps/steps and ECL technology. It has a programmable design for industrial applications requiring precise timing control in compact form factor with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,677 parts In-Stock

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Digiode

USA . 2,208 parts In-Stock

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AZTECH Wire

Italy . 721 parts In-Stock

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$9.750

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721

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Problanco Electronics

Mexico . 6,059 parts In-Stock

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SupplyDigital Components

Austria . 4,005 parts In-Stock

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TANS Electronics

Latvia . 3,159 parts In-Stock

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Corphita

USA . 1,734 parts In-Stock

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Kulean Microsystems

USA . 1,048 parts In-Stock

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UHIMA Technologies

Türkiye . 563 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 145 parts In-Stock

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Overview

Discover the cutting-edge MC100EP195MNR4G delay line by Onsemi, a leading manufacturer known for superior quality and reliability. This innovative product offers precise timing control with a wide range of applications in industries such as telecommunications, networking, and test equipment. With programmable features and advanced ECL technology, this delay line ensures optimal performance and accuracy. Experience seamless integration and enhanced functionality with the MC100EP195MNR4G, providing value and efficiency to customers seeking top-notch timing solutions.

Feature Benefit Bullets

Propagation Delay At Nominal Supply 15.8 ns

This low propagation delay ensures fast signal processing and reduces latency.

Surface Mount YES

Allows for easy and secure mounting on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V) 3.3

Compatible with common supply voltages, making integration into existing systems easier.

Maximum Operating Temperature 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

Technology ECL

ECL technology offers high-speed performance and low power consumption.

Programmable Delay Line YES

Flexibility to adjust delay parameters as needed for different applications.

Technical Specifications

Delay Lines MC100EP195MNR4G attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE= -3.0V TO -3.6V

Family:

100E

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Taps/Steps:

1023

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

175 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

15.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Nominal Total Delay (td):

12.2 ns

Width:

5 mm

Trade Compliance

MC100EP195MNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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