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MC100EP195BFAG

Onsemi

MC100EP195BFAG by Onsemi

MC100EP195BFAG by Onsemi is a delay line with 15.25ns propagation delay, 1023 taps, and ECL technology. It operates at -40 to 85°C, has 32 terminals in a flatpack package, and is ideal for industrial applications requiring precise signal timing control.

Median Price

$47.065

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$31.730

100+ parts

$19.730

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-

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1

$31.730

$19.730

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Chip1Stop

Japan . 279 parts In-Stock

1+ parts

$62.400

100+ parts

$38.100

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-

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279

$62.400

$38.100

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Distributors (In-Stock)

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Nova Conductors

Japan . 87 parts In-Stock

1+ parts

$21.220

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87

$21.220

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Digiode

USA . 1,755 parts In-Stock

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$25.574

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$25.574

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Vyrian

USA . 8,607 parts In-Stock

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8,607

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Flip Electronics

USA . 750 parts In-Stock

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750

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Distributors (Availability)

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AZTECH Wire

Italy . 872 parts In-Stock

1+ parts

$14.976

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-

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872

$14.976

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Corohmni

South Africa . 357 parts In-Stock

1+ parts

$20.380

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357

$20.380

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Continental Prestige Electronics

USA . 1,961 parts In-Stock

1+ parts

$21.220

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$20.796

1,961

$21.220

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$20.796

Ampacity Inc.

Singapore . 79 parts In-Stock

1+ parts

$22.880

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79

$22.880

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Corphita

USA . 169 parts In-Stock

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$24.228

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169

$24.228

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Aztec Data Supply Inc.

USA . 138 parts In-Stock

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$27.330

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138

$27.330

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Microchip USA

USA . 4,657 parts In-Stock

1+ parts

$64.975

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4,657

$64.975

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Problanco Electronics

Mexico . 7,765 parts In-Stock

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SupplyDigital Components

Austria . 7,743 parts In-Stock

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Kulean Microsystems

USA . 5,974 parts In-Stock

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TANS Electronics

Latvia . 4,069 parts In-Stock

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4,069

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Argo Parts USA

USA . 3,113 parts In-Stock

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UHIMA Technologies

Türkiye . 906 parts In-Stock

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906

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$20.796

1k+ parts

$20.159

10k+ parts

$19.735

500

-

$20.796

$20.159

$19.735

GreenTree Electronics

Israel . 379 parts In-Stock

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Authorized Procurement Solutions

USA . 309 parts In-Stock

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309

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Overview

Enhance your electronic designs with the MC100EP195BFAG delay line from Onsemi. With a focus on quality and innovation, Onsemi is a trusted manufacturer in the industry. This delay line offers precision timing solutions for a wide range of applications, ensuring reliable performance and accuracy. Whether you are working on telecommunications, data communications, or test and measurement systems, this product provides value, flexibility, and efficiency to meet your project needs. Upgrade your designs with the MC100EP195BFAG delay line and experience the difference today!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 15.25 ns

This low propagation delay ensures fast signal processing, making this delay line suitable for applications requiring precise timing.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with a commonly used supply voltage, making it easy to integrate into various electronic systems.

No. of Taps/Steps: 1023

Provides a high degree of flexibility in adjusting delay settings, allowing for fine-tuning of timing requirements in applications.

Technology: ECL

Utilizing Emitter-Coupled Logic technology for high-speed operation and low jitter, ensuring reliable performance in demanding applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, making it suitable for harsh environments and industrial applications.

Technical Specifications

Delay Lines MC100EP195BFAG attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V

Family:

100E

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Taps/Steps:

1023

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

170 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

15.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Nominal Total Delay (td):

12.2 ns

Width:

7 mm

Trade Compliance

MC100EP195BFAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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