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MC100E196FN

Onsemi

MC100E196FN by Onsemi

MC100E196FN by Onsemi is a 28-terminal ECL delay line with 127 taps and total delay of 3.63ns. It operates at -5.2V to 5V, with propagation delay of 4.72ns and peak reflow temp of 235 °C. Ideal for applications requiring precise signal delays in electronic circuits.

Median Price

$3.430

Lifecycle Status

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18

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1k+

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Rochester

USA . 17 parts In-Stock

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$3.430

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$3.070

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$2.890

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$2.890

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Digiode

USA . 617 parts In-Stock

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Vyrian

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Inventory MP

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Bristol Electronics

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Zilex Electronics Inc.

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EPE Components Inc.

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Prism Electronics

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Mil-Aero Solutions, Inc.

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Sensible Micro Corp

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Electronics Depot

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Corphita

USA . 2,421 parts In-Stock

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$3.438

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Corohmni

South Africa . 398 parts In-Stock

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Component Stockers USA

USA . 11 parts In-Stock

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$3.970

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QUARKTWIN TECHNOLOGY LTD

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TANS Electronics

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Overview

Discover the cutting-edge MC100E196FN delay line by Onsemi, a leading manufacturer known for top-quality components. Ideal for applications requiring precise timing, this delay line offers unparalleled performance and reliability. With its programmable design and advanced technology, customers can easily customize delay settings to suit their specific needs. Trust Onsemi's expertise and invest in the MC100E196FN for superior results in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 4.72 ns

The low propagation delay ensures fast signal processing, making the product suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard 5V supply voltage, making it compatible with a wide range of electronic devices and systems.

No. of Terminals: 28

The high number of terminals provides flexible connectivity options, allowing for versatile integration into different circuit layouts.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand challenging environmental conditions and operate reliably in various thermal scenarios.

Output Characteristics: OPEN-EMITTER

The open-emitter output type facilitates easy interfacing with other components, enhancing overall circuit design flexibility and compatibility.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, the product can function effectively in colder environments without performance issues.

Terminal Finish: TIN LEAD

The tin lead terminal finish ensures good solderability and reliable electrical connections, contributing to the product's overall quality and longevity.

Nominal Total Delay (td): 3.63 ns

The low total delay ensures minimal signal distortion and accurate signal transmission, crucial for high-speed data applications.

Technical Specifications

Delay Lines MC100E196FN attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE=-4.2 V TO -5.7 V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Taps/Steps:

127

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

156 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

4.72 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Nominal Total Delay (td):

3.63 ns

Width:

11.505 mm

Trade Compliance

MC100E196FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5999-01-434-8288, 5999014348288

NIIN

014348288

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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