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MC100E196FNG

Onsemi

MC100E196FNG by Onsemi

MC100E196FNG by Onsemi is a 28-terminal delay line with 127 taps/steps and ECL technology. It offers a total delay of 3.63ns, propagation delay of 4.72ns at 5V, and operates b/w -5.2V to 5.7V. Ideal for applications requiring precise signal delays in electronic circuits.

Median Price

$3.430

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13 parts In-Stock

1+ parts

-

100+ parts

$3.430

1k+ parts

$3.070

10k+ parts

$2.890

13

-

$3.430

$3.070

$2.890

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 999 parts In-Stock

1+ parts

$3.629

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-

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999

$3.629

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Vyrian

USA . 2,033 parts In-Stock

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2,033

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Distributors (Availability)

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Corphita

USA . 2,244 parts In-Stock

1+ parts

$3.438

100+ parts

-

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2,244

$3.438

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Corohmni

South Africa . 432 parts In-Stock

1+ parts

$3.820

100+ parts

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432

$3.820

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AZTECH Wire

Italy . 880 parts In-Stock

1+ parts

$18.110

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880

$18.110

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TANS Electronics

Latvia . 5,798 parts In-Stock

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5,798

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SupplyDigital Components

Austria . 3,791 parts In-Stock

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3,791

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Kulean Microsystems

USA . 2,724 parts In-Stock

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2,724

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Problanco Electronics

Mexico . 2,536 parts In-Stock

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2,536

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Microchip USA

USA . 431 parts In-Stock

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431

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UHIMA Technologies

Türkiye . 110 parts In-Stock

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Overview

Enhance your electronic projects with the MC100E196FNG delay line by Onsemi, a premium quality component offering precision timing and reliable performance. Manufactured by industry leader Onsemi, this chip carrier package features a programmable delay line with 127 taps/steps, making it ideal for applications requiring precise synchronization. With a nominal total delay of 3.63 ns and a propagation delay of 4.72 ns at a nominal supply voltage of 5V, this delay line ensures optimal functionality. Trust Onsemi's reputation for excellence and invest in the MC100E196FNG for seamless integration and enhanced efficiency in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the delay line, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 4.72 ns

The low propagation delay ensures fast and efficient signal transmission, making this delay line suitable for time-sensitive applications.

Surface Mount: YES

Being surface mountable makes installation and integration of this delay line easier and more convenient in electronic circuit designs.

Package Shape: SQUARE

The square shape allows for efficient use of space on a circuit board, maximizing density and minimizing wasted space.

Nominal Supply Voltage / Vsup (V): 5

This voltage requirement is commonly found in many electronic systems, making integration of this delay line straightforward.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making this delay line suitable for high-performance applications.

Programmable Delay Line: YES

The ability to programmable the delay allows for flexibility in adjusting the timing of signals, making this delay line versatile in various applications.

Technical Specifications

Delay Lines MC100E196FNG attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE=-4.2 V TO -5.7 V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

No. of Functions:

1

No. of Taps/Steps:

127

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

156 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

4.72 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Nominal Total Delay (td):

3.63 ns

Width:

11.505 mm

Trade Compliance

MC100E196FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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