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MC100EP196BFA

Onsemi

MC100EP196BFA by Onsemi

MC100EP196BFA by Onsemi is a delay line with 15.25ns propagation delay, 1023 taps/steps, and ECL technology. It is used in industrial applications for precise timing control due to its programmable feature and complementary output polarity. The device operates within a temperature range of -40 to 85 °C and has a low profile flatpack package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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USA . 4,567 parts In-Stock

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Digiode

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Kulean Microsystems

USA . 6,587 parts In-Stock

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SupplyDigital Components

Austria . 6,350 parts In-Stock

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TANS Electronics

Latvia . 3,801 parts In-Stock

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Problanco Electronics

Mexico . 3,105 parts In-Stock

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Corphita

USA . 1,489 parts In-Stock

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UHIMA Technologies

Türkiye . 906 parts In-Stock

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Corohmni

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Overview

Discover the MC100EP196BFA delay line by Onsemi, a top-quality product designed to meet your timing needs with precision and reliability. Manufactured by Onsemi, a leader in semiconductor solutions, this delay line offers unparalleled performance and versatility for a wide range of applications. With its programmable features and advanced technology, this delay line provides customers with the value, benefits, and advantages they need to optimize their designs and achieve exceptional results. Trust Onsemi and the MC100EP196BFA to deliver outstanding performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protects the internal components of the delay line, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 15.25 ns

The low propagation delay ensures efficient signal transmission, making it suitable for applications where timing accuracy is crucial.

Surface Mount: YES

Being surface mountable makes installation easier, especially in compact electronic devices where space is limited.

Nominal Supply Voltage / Vsup (V): 3.3

This compatible voltage level ensures the delay line can easily integrate with various systems without requiring additional voltage regulation.

Power Supplies (V): +-3.3

The symmetrical power supplies support stable operation and prevent voltage fluctuations, enhancing the overall performance of the delay line.

No. of Terminals: 32

Having multiple terminals allows for versatile connectivity options, enabling the delay line to be used in a wide range of electronic circuits.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making this delay line suitable for applications requiring quick response times.

Programmable Delay Line: YES

The ability to programmatically adjust the delay allows for flexibility in signal timing, making this delay line suitable for dynamic applications that require variable delays.

Technical Specifications

Delay Lines MC100EP196BFA attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V

Family:

100E

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Taps/Steps:

1023

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

+-3.3

Maximum Power Supply Current (ICC):

175 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

15.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Nominal Total Delay (td):

12.4 ns

Width:

7 mm

Trade Compliance

MC100EP196BFA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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