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MC100EP195TBD

Onsemi

MC100EP195TBD by Onsemi

MC100EP195TBD by Onsemi is a 32-terminal delay line with ECL100K technology. It operates at -3.3/-5V, has a max temp of 85 °C, and features programmable delays. Ideal for applications requiring precise timing control in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,638 parts In-Stock

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Digiode

USA . 728 parts In-Stock

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Problanco Electronics

Mexico . 6,574 parts In-Stock

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6,574

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TANS Electronics

Latvia . 4,759 parts In-Stock

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4,759

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Kulean Microsystems

USA . 2,944 parts In-Stock

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SupplyDigital Components

Austria . 2,362 parts In-Stock

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UHIMA Technologies

Türkiye . 948 parts In-Stock

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948

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Corphita

USA . 176 parts In-Stock

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Corohmni

South Africa . 69 parts In-Stock

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Overview

Unleash the power of precision with the MC100EP195TBD by Onsemi. This delay line is a game-changer, offering unparalleled quality and reliability in a compact chip carrier package. Whether you're working on telecommunications, networking, or high-speed computing applications, this programmable delay line will revolutionize your designs. Say goodbye to guesswork and hello to precise timing control with the MC100EP195TBD. Trust Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Power Supplies (V): -3.3/-5

The wide range of power supply voltage options (-3.3/-5) provides flexibility for different system requirements and compatibility.

No. of Terminals: 32

With 32 terminals, this delay line can handle complex connections and signal pathways, making it suitable for advanced electronic systems.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers high density integration and efficient heat dissipation, making it a space-saving and reliable choice.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures functionality even in colder environments, increasing the product's versatility.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good conductivity and solderability, ensuring stable connections and signal transmission.

Terminal Position: QUAD

The quad terminal configuration allows for easy and organized connectivity, facilitating efficient installation and maintenance.

Output Polarity: COMPLEMENTARY

The complementary output polarity offers balanced signal processing and compatibility with various electronic components and systems.

Technology: ECL100K

Utilizing ECL100K technology ensures high-speed and low-power operation, making the delay line suitable for demanding applications requiring precision timing.

Terminal Form: J BEND

The J Bend terminal form provides mechanical stability and easy handling during installation, enhancing the overall reliability and usability of the product.

Programmable Delay Line: YES

The programmable delay line feature allows for customized signal delays, offering flexibility and adaptability in various electronic systems and designs.

Technical Specifications

Delay Lines MC100EP195TBD attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

JESD-609 Code:

e0

No. of Functions:

1

No. of Taps/Steps:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32(UNSPEC)

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

-3.3/-5

Programmable Delay Line:

YES

Qualification:

Not Qualified

Sub-Category:

Delay Lines

Surface Mount:

YES

Technology:

ECL100K

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

MC100EP195TBD Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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