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MC100E195FN

Onsemi

MC100E195FN by Onsemi

MC100E195FN by Onsemi is a delay line with 4.72ns propagation delay at 5V, ECL technology, and 127 taps/steps. It is used in applications requiring precise timing control, such as high-speed communication systems and data transmission equipment.

Median Price

$8.775

Lifecycle Status

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23

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Freelance Electronics

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Bristol Electronics

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Forefront Electronics and Design

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Semi Source

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Elcom Components

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Semtec, LLC

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Mil-Aero Solutions, Inc.

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Lighthouse Electronics, Inc.

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Sunrise Surplus Inc.

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ECAB

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Resion

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Connector Distribution Corp

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Right Parts Inc.

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Lakeland Logistics Inc

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Corohmni

South Africa . 245 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

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Kulean Microsystems

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SupplyDigital Components

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Microchip USA

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GreenTree Electronics

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UHIMA Technologies

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Speed Components Ltd (Excess)

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Overview

Unleash the power of precision timing with the MC100E195FN by Onsemi. Crafted with the utmost quality and expertise, this delay line is designed to elevate performance in a variety of applications. From telecommunications to industrial automation, this innovative product delivers unparalleled accuracy and reliability. Say goodbye to delays and hello to seamless operations with the MC100E195FN. Trust Onsemi to provide you with the tools you need to stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the delay line, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 4.72 ns

Low propagation delay ensures fast signal processing and minimal signal distortion.

Surface Mount: YES

Ease of installation and space-saving design make it suitable for compact electronic applications.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage compatibility for easy integration into various systems.

Output Characteristics: OPEN-EMITTER

Provides flexibility in output signal configuration and compatibility with different circuit designs.

Nominal Total Delay (td): 3.63 ns

Offers precise delay control and accurate signal synchronization for optimal performance.

Technology: ECL

Utilizes ECL technology known for high-speed operation, low power consumption, and reliable performance.

Programmable Delay Line: YES

Ability to adjust delay parameters programmatically enhances versatility and adaptability in various applications.

Technical Specifications

Delay Lines MC100E195FN attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Taps/Steps:

127

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

156 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

4.72 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Nominal Total Delay (td):

3.63 ns

Width:

11.505 mm

Trade Compliance

MC100E195FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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