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SNJ54LS31FK

Texas Instruments

SNJ54LS31FK by Texas Instruments

SNJ54LS31FK by Texas Instruments is a TTL delay line chip carrier with 20 terminals. It operates at a supply voltage of 5V, has a total delay of 105ns, and can handle load capacitance of 15pF. This military-grade component is ideal for applications requiring precise signal timing in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,272 parts In-Stock

1+ parts

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4,272

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Digiode

USA . 2,695 parts In-Stock

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2,695

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,515 parts In-Stock

1+ parts

$16.562

100+ parts

-

1k+ parts

$16.839

10k+ parts

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1,515

$16.562

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$16.839

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AZTECH Wire

Italy . 776 parts In-Stock

1+ parts

$17.571

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776

$17.571

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DigiPath Technology Company

USA . 338 parts In-Stock

1+ parts

$18.237

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-

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338

$18.237

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ChromeModa Solutions

Germany . 5,982 parts In-Stock

1+ parts

$18.609

100+ parts

$15.259

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-

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5,982

$18.609

$15.259

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IDEA Electronic Components Group

UK . 2,145 parts In-Stock

1+ parts

$18.609

100+ parts

$17.679

1k+ parts

$16.748

10k+ parts

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2,145

$18.609

$17.679

$16.748

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One Stop Electronics

USA . 498 parts In-Stock

1+ parts

$62.000

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498

$62.000

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Corphita

USA . 2,766 parts In-Stock

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2,766

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Overview

Enhance your electronic projects with the SNJ54LS31FK by Texas Instruments. As a trusted manufacturer, Texas Instruments delivers top-quality delay lines like this one, perfect for a wide range of applications. This versatile chip carrier offers a nominal total delay of 105 ns and operates at a temperature grade of MILITARY, ensuring reliability in any environment. With a surface-mount design and a load capacitance of 15 pF, this component provides precise timing control for your circuits. Trust Texas Instruments for high-performance solutions that add value to your designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired body material ensures durability and reliability of the delay line.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation of the delay line onto PCBs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this delay line compatible with standard electronic systems.

Load Capacitance (CL): 15 pF

The low load capacitance of 15 pF helps in maintaining signal integrity and accuracy.

Temperature Grade: MILITARY

The military-grade temperature range of -55°C to 125°C ensures reliable performance in extreme conditions.

Nominal Total Delay (td): 105 ns

The nominal total delay of 105 ns makes this delay line suitable for various timing applications.

Technology: TTL

Utilizing TTL technology ensures compatibility with TTL logic levels, making it easy to integrate into existing systems.

Technical Specifications

Delay Lines SNJ54LS31FK attributes and parameters. Explore more Delay Lines devices from Texas Instruments

Specs

Additional Features:

INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS

Family:

LS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

1

No. of Taps/Steps:

0

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Programmable Delay Line:

NO

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

2.03 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Nominal Total Delay (td):

105 ns

Width:

8.89 mm

Trade Compliance

SNJ54LS31FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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