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SNJ54LS31J

Texas Instruments

SNJ54LS31J by Texas Instruments

SNJ54LS31J by Texas Instruments is a TTL delay line with 16 terminals and a total delay of 105ns. Operating b/w -55°C to 125°C, it has a supply voltage range of 4.5V to 5.5V and can handle up to 20mA power supply current. This rectangular package is ideal for military-grade applications requiring precise signal delays in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,148 parts In-Stock

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Digiode

USA . 1,605 parts In-Stock

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1,605

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Distributors (Availability)

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AZTECH Wire

Italy . 863 parts In-Stock

1+ parts

$11.317

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863

$11.317

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Parana Technologies

USA . 850 parts In-Stock

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$12.026

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$12.432

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850

$12.026

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$12.432

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ChromeModa Solutions

Germany . 2,613 parts In-Stock

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$13.512

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$11.080

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2,613

$13.512

$11.080

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IDEA Electronic Components Group

UK . 1,433 parts In-Stock

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$13.512

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$12.836

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$12.161

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1,433

$13.512

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$12.161

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One Stop Electronics

USA . 139 parts In-Stock

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$17.000

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139

$17.000

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Corphita

USA . 3,856 parts In-Stock

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3,856

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DigiPath Technology Company

USA . 263 parts In-Stock

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$12.182

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$12.182

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Overview

Enhance your electronic designs with the SNJ54LS31J by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge delay line technology that is essential for a wide range of applications. Whether you're working on telecommunications systems or precision timing circuits, this product offers unmatched value and performance. Stay ahead of the competition with the SNJ54LS31J and experience the benefits of superior design and innovation in every project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and reliability for the delay line, ensuring long-term performance.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement that is easily met in most applications.

Load Capacitance (CL): 15 pF

Optimal capacitance for efficient signal transmission and minimal interference.

Maximum Operating Temperature: 125 °C

Allows the delay line to function in a wide range of environments without overheating.

Technology: TTL

Uses transistor-transistor logic technology for fast and reliable signal processing.

Technical Specifications

Delay Lines SNJ54LS31J attributes and parameters. Explore more Delay Lines devices from Texas Instruments

Specs

Additional Features:

INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS

Family:

LS

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

1

No. of Taps/Steps:

0

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Programmable Delay Line:

NO

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Nominal Total Delay (td):

105 ns

Width:

7.62 mm

Trade Compliance

SNJ54LS31J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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