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MC100EP196BFAG

Onsemi

MC100EP196BFAG by Onsemi

MC100EP196BFAG by Onsemi is a delay line with 15.25ns propagation delay, 1023 taps, and ECL technology. It operates at -40 to 85°C and has a supply voltage of +-3.3V. Ideal for industrial applications requiring precise signal delays in compact spaces.

Median Price

$13.100

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5,881 parts In-Stock

1+ parts

-

100+ parts

$13.790

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5,881

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$13.790

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Flip Electronics (Authorized)

USA . 4,861 parts In-Stock

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4,861

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Rochester

USA . 4,492 parts In-Stock

1+ parts

-

100+ parts

$10.480

1k+ parts

$9.380

10k+ parts

$8.820

4,492

-

$10.480

$9.380

$8.820

Verical

USA . 2,207 parts In-Stock

1+ parts

-

100+ parts

$13.100

1k+ parts

$11.725

10k+ parts

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2,207

-

$13.100

$11.725

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,019 parts In-Stock

1+ parts

$11.086

100+ parts

-

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2,019

$11.086

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Vyrian

USA . 492 parts In-Stock

1+ parts

$11.670

100+ parts

-

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492

$11.670

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Flip Electronics

USA . 4,567 parts In-Stock

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4,567

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Electronics Depot

USA . 61 parts In-Stock

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61

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A2Z Electronics, Inc.

USA . 19 parts In-Stock

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19

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Bristol Electronics

USA . 19 parts In-Stock

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19

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 56 parts In-Stock

1+ parts

$10.503

100+ parts

-

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56

$10.503

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Corohmni

South Africa . 374 parts In-Stock

1+ parts

$11.670

100+ parts

-

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374

$11.670

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SupplyDigital Components

Austria . 8,084 parts In-Stock

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8,084

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TANS Electronics

Latvia . 7,613 parts In-Stock

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7,613

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Kulean Microsystems

USA . 1,907 parts In-Stock

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1,907

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Microchip USA

USA . 1,276 parts In-Stock

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1,276

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Problanco Electronics

Mexico . 711 parts In-Stock

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711

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UHIMA Technologies

Türkiye . 699 parts In-Stock

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699

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Overview

Enhance your electronic designs with the MC100EP196BFAG delay line from Onsemi, a trusted manufacturer known for top-quality components. Ideal for a wide range of applications, this delay line offers precise timing control and reliable performance. With its advanced technology and programmable features, customers can easily customize their designs to meet specific requirements. Experience the value and benefits of this product, whether you're working on telecommunications, data communications, or industrial applications. Trust Onsemi to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the delay line, ensuring its long-term functionality.

Propagation Delay At Nominal Supply: 15.25 ns

The fast propagation delay at the nominal supply voltage allows for efficient signal processing and quick response times in electronic circuits.

Surface Mount: YES

Being surface mountable makes installation and integration of the delay line into circuit boards easier and more cost-effective.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in many electronic devices, making this delay line compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this delay line can withstand and perform reliably in harsh industrial environments.

Output Polarity: COMPLEMENTARY

The complementary output polarity enhances signal integrity and reduces interference in the circuit, resulting in more accurate data transmission.

Programmable Delay Line: YES

The programmable feature allows for flexibility in adjusting the delay settings, catering to specific timing requirements in various applications.

Technical Specifications

Delay Lines MC100EP196BFAG attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V

Family:

100E

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Taps/Steps:

1023

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-3.3

Maximum Power Supply Current (ICC):

175 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

15.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Nominal Total Delay (td):

12.4 ns

Width:

7 mm

Trade Compliance

MC100EP196BFAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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