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MC100LVEL58DR2

Onsemi

MC100LVEL58DR2 by Onsemi

MC100LVEL58DR2 by Onsemi is a 2-input multiplexer with 0.57 ns propagation delay at 3.3V. It operates in industrial temperature range (-40 to 85 °C) and has complementary output polarity. Suitable for high-speed applications requiring fast signal switching in compact designs.

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4

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1k+

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Vyrian

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ACDS - Activité Composants Distribution Service

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Digiode

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Semtec, LLC

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AZTECH Wire

Italy . 1,031 parts In-Stock

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Component Stockers USA

USA . 315 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

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Metaverse IC Inc.

Canada . 7,490 parts In-Stock

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Kepictronics

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Microchip USA

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SupplyDigital Components

Austria . 2,769 parts In-Stock

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Problanco Electronics

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TANS Electronics

Latvia . 2,107 parts In-Stock

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Perfect Parts

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Corphita

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Cyclops Electronics Ltd (Excess)

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UHIMA Technologies

Türkiye . 657 parts In-Stock

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Corohmni

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Kulean Microsystems

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Authorized Procurement Solutions

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Overview

Elevate your electronic designs with the MC100LVEL58DR2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products like this multiplexer & demultiplexer that offer unparalleled performance and reliability. Ideal for a wide range of applications, this product provides fast propagation delay and precise output polarity to meet your project needs. Experience the value and benefits of choosing Onsemi for all your semiconductor component requirements - trust in quality, innovation, and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 0.59 ns

Low propagation delay ensures fast and efficient signal processing, making the product ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

No. of Inputs: 2

Having 2 inputs provides flexibility in signal routing and multiplexing/demultiplexing operations.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage of 3.3V makes it compatible with common power systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making the product efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer MC100LVEL58DR2 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVEL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

-3.3

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

.59 ns

Propagation Delay (tpd):

.57 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC100LVEL58DR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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