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MC100EP31DTR2

Onsemi

MC100EP31DTR2 by Onsemi

MC100EP31DTR2 by Onsemi is a latches & flip-flops IC with 8 terminals, operating at -40 to 85 °C. It features a propagation delay of 0.41ns, trigger type positive edge, and max frequency of 3GHz. Ideal for industrial applications requiring fast signal processing in compact designs.

Median Price

$7.690

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 1,860 parts In-Stock

1+ parts

$7.690

100+ parts

$5.770

1k+ parts

$5.000

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1,860

$7.690

$5.770

$5.000

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Vyrian

USA . 6,041 parts In-Stock

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Digiode

USA . 438 parts In-Stock

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438

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 57 parts In-Stock

1+ parts

$7.690

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57

$7.690

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AZTECH Wire

Italy . 451 parts In-Stock

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$21.810

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451

$21.810

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Component Stockers USA

USA . 627 parts In-Stock

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$99.990

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627

$99.990

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TANS Electronics

Latvia . 5,744 parts In-Stock

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Microchip USA

USA . 3,972 parts In-Stock

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SupplyDigital Components

Austria . 3,488 parts In-Stock

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Kulean Microsystems

USA . 2,792 parts In-Stock

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2,792

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UHIMA Technologies

Türkiye . 627 parts In-Stock

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627

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Problanco Electronics

Mexico . 294 parts In-Stock

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Corphita

USA . 286 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the MC100EP31DTR2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality latches and flip-flops that are essential for various applications. With a small outline, thin profile package and a wide temperature range, this product offers reliability and versatility. From industrial automation to telecommunications, the MC100EP31DTR2 provides fast signal propagation and precise triggering, ensuring seamless operation at high frequencies. Trust Onsemi for innovative solutions that drive efficiency and performance in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the latch or flip-flop, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with a wide range of circuits and systems.

Power Supplies (V): -4.5

Provides the necessary power supply for the latch or flip-flop to function effectively.

Propagation Delay (tpd): 0.41 ns

Offers fast signal processing, ensuring timely and accurate output transitions.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments with varying heat levels.

Trigger Type: POSITIVE EDGE

Triggering on positive edges allows for precise control and synchronization of data signals.

Maximum Frequency At Nominal Supply: 3000000000 Hz

Can operate at high frequencies, making it ideal for applications requiring fast data processing.

Technical Specifications

Latches & Flip-Flops MC100EP31DTR2 attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V

Family:

100E

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

47 mA

Propagation Delay (tpd):

.41 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Trade Compliance

MC100EP31DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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