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MC100EP01DTR2

Onsemi

MC100EP01DTR2 by Onsemi

MC100EP01DTR2 by Onsemi is a logic gate with 4 inputs, 0.35 ns propagation delay, and 3.3V nominal voltage. It is used in industrial applications for high-speed signal processing due to its ECL technology and small outline package style. With a wide operating temperature range of -40 to 85 °C, it offers reliable performance in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,787 parts In-Stock

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Digiode

USA . 1,579 parts In-Stock

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AZTECH Wire

Italy . 266 parts In-Stock

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$15.740

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Kulean Microsystems

USA . 5,769 parts In-Stock

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Microchip USA

USA . 2,989 parts In-Stock

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Corphita

USA . 2,291 parts In-Stock

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SupplyDigital Components

Austria . 1,499 parts In-Stock

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Problanco Electronics

Mexico . 1,367 parts In-Stock

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TANS Electronics

Latvia . 896 parts In-Stock

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UHIMA Technologies

Türkiye . 582 parts In-Stock

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Corohmni

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Overview

Unlock unparalleled speed and precision with the MC100EP01DTR2 logic gate by Onsemi. Crafted with cutting-edge ECL technology, this small outline, thin profile gate boasts a mere 0.33 ns propagation delay - perfect for industrial applications that demand lightning-fast response times. With a robust construction and a wide temperature range, this logic gate ensures reliable performance even in the harshest environments. Trust Onsemi's expertise in semiconductor manufacturing to deliver high-quality components that exceed your expectations. Elevate your projects with the MC100EP01DTR2 and experience the power of precision engineering at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic provides good durability and resistance to external elements, making it suitable for various environments.

Propagation Delay At Nominal Supply: 0.35 ns

Low propagation delay ensures fast processing speed and high performance.

Surface Mount: YES

Surface mount installation allows for easy and efficient PCB assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, making it compatible with most systems.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, allowing for reliable operation in various conditions.

Minimum Operating Temperature: -40 °C

Functions well even in extreme cold temperatures, ensuring versatility in usage.

Technology: ECL

Uses Emitter-Coupled Logic technology for high-speed and low-power consumption.

Technical Specifications

Logic Gates MC100EP01DTR2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

4

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

.35 ns

Propagation Delay (tpd):

.33 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

MC100EP01DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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