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LV5236VZ-MPB-H

Onsemi

LV5236VZ-MPB-H by Onsemi

LV5236VZ-MPB-H by Onsemi is a Graphics Display Driver with 44 terminals, operating at -25 to 75 °C. It features SERIAL data input mode, 5.5V max supply voltage, and BICMOS technology. Ideal for LED display driver applications due to its small outline package and low profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,317 parts In-Stock

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Digiode

USA . 2,217 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 427 parts In-Stock

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$8.970

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427

$8.970

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Ampacity Inc.

Singapore . 892 parts In-Stock

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$31.500

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Component Stockers USA

USA . 289 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 8,205 parts In-Stock

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Microchip USA

USA . 5,269 parts In-Stock

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Kulean Microsystems

USA . 4,948 parts In-Stock

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Problanco Electronics

Mexico . 3,421 parts In-Stock

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SupplyDigital Components

Austria . 1,270 parts In-Stock

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UHIMA Technologies

Türkiye . 636 parts In-Stock

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Corphita

USA . 100 parts In-Stock

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Corohmni

South Africa . 96 parts In-Stock

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Perfect Parts

USA . 25 parts In-Stock

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Overview

Experience superior quality and unmatched performance with the LV5236VZ-MPB-H by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge Graphics Display Drivers that are designed for excellence. Whether you're in need of display drivers for automotive displays, industrial control panels, or consumer electronics, this product offers exceptional value, reliability, and efficiency. With its advanced technology and wide range of applications, the LV5236VZ-MPB-H is the perfect choice for all your display driver needs. Elevate your projects with Onsemi's top-notch solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the display driver easy to handle and long-lasting.

Data Input Mode: SERIAL

Serial data input mode allows for fast and efficient communication with other devices, enhancing the overall performance of the display driver.

Surface Mount: YES

Surface mount capability makes installation and integration of the display driver more convenient and space-efficient.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, the display driver can handle a wide range of power inputs, increasing its versatility.

Package Shape: RECTANGULAR

Rectangular package shape is compact and space-saving, ideal for applications where size constraints are a concern.

No. of Terminals: 44

Having a large number of terminals allows for more connectivity options, enabling the display driver to interface with multiple components.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

This package style ensures efficient heat dissipation, low profile design, and reduced pitch size, contributing to the overall reliability and performance of the display driver.

Minimum Operating Temperature: -25 °C

The display driver can operate in low temperatures, making it suitable for a wide range of environments and applications.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, the display driver can withstand heat without compromising performance or longevity.

Terminal Finish: TIN BISMUTH

Tin bismuth terminal finish provides good electrical conductivity and reliability, ensuring stable connections and signal transmission.

Technology: BICMOS

BICMOS technology offers a balance of performance and power efficiency, enhancing the overall functionality of the display driver.

Technical Specifications

Graphics Display Drivers LV5236VZ-MPB-H attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e6

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

24

No. of Terminals:

44

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.6 mm

Minimum fmax:

.1 MHz

Trade Compliance

LV5236VZ-MPB-H Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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