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LV5236V-MPB-H

Onsemi

LV5236V-MPB-H by Onsemi

LV5236V-MPB-H by Onsemi is a Graphics Display Driver with 44 terminals, operating at -25 to 75 °C. It has a supply voltage range of 4.5-5.5 V and uses SERIAL data input mode. Ideal for LED display driver applications due to its BICMOS technology and small outline package style.

Median Price

$2.540

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 55 parts In-Stock

1+ parts

$2.540

100+ parts

$2.490

1k+ parts

$2.440

10k+ parts

-

55

$2.540

$2.490

$2.440

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,285 parts In-Stock

1+ parts

$2.413

100+ parts

-

1k+ parts

-

10k+ parts

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1,285

$2.413

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-

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Vyrian

USA . 1,948 parts In-Stock

1+ parts

-

100+ parts

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1,948

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,044 parts In-Stock

1+ parts

$2.286

100+ parts

-

1k+ parts

-

10k+ parts

-

1,044

$2.286

-

-

-

Corohmni

South Africa . 403 parts In-Stock

1+ parts

$2.540

100+ parts

-

1k+ parts

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10k+ parts

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403

$2.540

-

-

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AZTECH Wire

Italy . 154 parts In-Stock

1+ parts

$19.950

100+ parts

-

1k+ parts

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154

$19.950

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-

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Component Stockers USA

USA . 755 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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10k+ parts

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755

$99.990

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-

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,099 parts In-Stock

1+ parts

-

100+ parts

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24,099

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TANS Electronics

Latvia . 7,810 parts In-Stock

1+ parts

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7,810

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Kulean Microsystems

USA . 6,336 parts In-Stock

1+ parts

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6,336

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Microchip USA

USA . 4,458 parts In-Stock

1+ parts

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4,458

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Problanco Electronics

Mexico . 2,442 parts In-Stock

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2,442

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SupplyDigital Components

Austria . 938 parts In-Stock

1+ parts

-

100+ parts

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938

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UHIMA Technologies

Türkiye . 612 parts In-Stock

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612

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Overview

Elevate your displays to the next level with the LV5236V-MPB-H by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Graphics Display Drivers that are ideal for a range of applications. This product offers unparalleled value and benefits, providing customers with seamless data input mode, high maximum supply voltage, and a small outline package style for compact designs. Elevate your projects with the reliability and performance of Onsemi's LV5236V-MPB-H.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, while also providing good durability and protection for the internal components.

Data Input Mode: SERIAL

Serial data input mode allows for efficient communication and control of the display driver, making it easier to integrate with other digital systems.

Surface Mount: YES

Surface mount capability enables easy and secure placement of the display driver on a circuit board, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in system design.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and allows for easy mounting and placement within a circuit design.

No. of Terminals: 44

Having 44 terminals allows for versatile connectivity options and functionality, enabling the display driver to support a wide range of display configurations.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature ensures reliable performance in a variety of environmental conditions, making the display driver suitable for diverse applications.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures that the display driver can function effectively even in cold environments, enhancing its versatility and reliability.

Technical Specifications

Graphics Display Drivers LV5236V-MPB-H attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e6

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

24

No. of Terminals:

44

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.6 mm

Minimum fmax:

.1 MHz

Trade Compliance

LV5236V-MPB-H Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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