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LC88FC2H0BUTJ-2H

Onsemi

LC88FC2H0BUTJ-2H by Onsemi

LC88FC2H0BUTJ-2H by Onsemi is a 16-bit microcontroller with 524288 ROM words, 24576 RAM bytes, and 16-Ch 12-Bit ADC channels. Ideal for industrial applications, it features peripherals like POR, PWM(2), RTC, TIMER(9), WDT and connectivity options such as I2C(3), SIO(3), UART(3). Operating at a max clock frequency of 24 MHz, this microcontroller has a temperature range from -40 to 85 °C.

Median Price

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Lifecycle Status

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1k+

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Vyrian

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Digiode

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AZTECH Wire

Italy . 485 parts In-Stock

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

USA . 6,641 parts In-Stock

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SupplyDigital Components

Austria . 5,574 parts In-Stock

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Problanco Electronics

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Microchip USA

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TANS Electronics

Latvia . 3,080 parts In-Stock

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Corphita

USA . 2,218 parts In-Stock

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Kulean Microsystems

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Corohmni

South Africa . 347 parts In-Stock

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UHIMA Technologies

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Overview

Unlock the possibilities with the LC88FC2H0BUTJ-2H by Onsemi, a cutting-edge microcontroller that offers unparalleled quality and reliability. Manufactured by Onsemi, a renowned leader in the industry, this device is perfect for a wide range of applications. With its advanced technology and innovative features, this microcontroller provides customers with exceptional value and benefits. Experience seamless connectivity, high-speed performance, and versatile capabilities with this top-of-the-line product. Choose Onsemi for superior quality and unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer high durability and resistance to environmental factors, making the microcontroller suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with various electrical systems.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle more complex operations and calculations compared to lower bit sizes, enhancing its performance capabilities.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and signals, expanding its functionality in diverse sensor-based applications.

ROM Words: 524288

The large ROM size allows for storing extensive program codes and data, making the microcontroller suitable for applications requiring substantial memory space.

Maximum Clock Frequency: 24 MHz

A high clock frequency of 24 MHz enables the microcontroller to execute instructions at a faster rate, resulting in quicker processing and response times in real-time applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with integrated peripherals, it offers a compact and efficient solution for controlling various functions within a system without the need for external components.

RAM Bytes: 24576

The generous RAM capacity of 24576 bytes allows for efficient data storage and manipulation during program execution, enhancing the microcontroller's performance in multitasking applications.

Analog To Digital Convertors: 16-Ch 12-Bit

With 16 analog to digital converters at 12-bit resolution, the microcontroller can accurately convert analog signals into digital data, facilitating precise measurement and control in analog input applications.

Connectivity: I2C(3), SIO(3), UART(3)

The multiple connectivity options such as I2C, SIO, and UART provide flexible communication interfaces for connecting to other devices, enabling seamless data exchange and control in networked systems.

Technical Specifications

Microcontrollers LC88FC2H0BUTJ-2H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO AVAILABLE ADC WITH 16-CH 8-BIT; ALSO OPERATES AT 2.7 TO 3.6V @ 10 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

90

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Bytes:

24576

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

12 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), SIO(3), UART(3)

Peripherals:

POR, PWM(2), RTC, TIMER(9), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

LC88FC2H0BUTJ-2H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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