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LC87FBK08AU-SSOP-H

Onsemi

LC87FBK08AU-SSOP-H by Onsemi

LC87FBK08AU-SSOP-H by Onsemi is an 8-bit microcontroller with 24 terminals, operating at a max frequency of 12 MHz. It features 256 bytes of RAM, 8192 ROM words, and supports PWM channels. Ideal for industrial applications requiring a compact design and low power consumption.

Median Price

$2.202

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2,710 parts In-Stock

1+ parts

$2.780

100+ parts

$2.560

1k+ parts

$2.400

10k+ parts

-

2,710

$2.780

$2.560

$2.400

-

Mouser Electronics

USA . 325 parts In-Stock

1+ parts

$2.950

100+ parts

$2.160

1k+ parts

$1.540

10k+ parts

$1.400

325

$2.950

$2.160

$1.540

$1.400

Rochester

USA . 2,710 parts In-Stock

1+ parts

-

100+ parts

$1.450

1k+ parts

$1.300

10k+ parts

$1.220

2,710

-

$1.450

$1.300

$1.220

Verical

USA . 1,610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.625

10k+ parts

-

1,610

-

-

$1.625

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 495 parts In-Stock

1+ parts

$1.520

100+ parts

-

1k+ parts

-

10k+ parts

-

495

$1.520

-

-

-

Vyrian

USA . 2,129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,129

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 896 parts In-Stock

1+ parts

$1.440

100+ parts

-

1k+ parts

-

10k+ parts

-

896

$1.440

-

-

-

Corohmni

South Africa . 211 parts In-Stock

1+ parts

$1.600

100+ parts

-

1k+ parts

-

10k+ parts

-

211

$1.600

-

-

-

Continental Prestige Electronics

USA . 2,710 parts In-Stock

1+ parts

$2.380

100+ parts

$2.190

1k+ parts

$2.050

10k+ parts

-

2,710

$2.380

$2.190

$2.050

-

Authorized Procurement Solutions

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12,000

-

-

-

-

SupplyDigital Components

Austria . 6,912 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,912

-

-

-

-

TANS Electronics

Latvia . 6,455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,455

-

-

-

-

Problanco Electronics

Mexico . 5,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,004

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 4,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,575

-

-

-

-

Kulean Microsystems

USA . 2,163 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,163

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-

-

-

Microchip USA

USA . 477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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477

-

-

-

-

UHIMA Technologies

Türkiye . 70 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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70

-

-

-

-

Overview

Elevate your projects with the LC87FBK08AU-SSOP-H by Onsemi, a top-tier microcontroller that delivers unparalleled performance and reliability. Crafted by Onsemi, a renowned manufacturer known for cutting-edge technology, this microcontroller is perfect for a wide range of applications. With its advanced features and precise design, this product offers exceptional value to customers, providing seamless functionality and unmatched efficiency. Upgrade your projects today with the LC87FBK08AU-SSOP-H and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microcontroller, ensuring reliable performance in various environments.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5 V allows for flexibility in power supply options and compatibility with a wide range of systems.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost, making this microcontroller suitable for many applications.

No. of I/O Lines: 19

Having 19 I/O lines allows for versatile connectivity with external devices, enabling a wide range of input and output configurations.

ADC Channels: YES

Integrated ADC channels enable analog sensing and signal processing capabilities, expanding the range of applications this microcontroller can be used in.

ROM Programmability: FLASH

Flash programmability enables easy firmware updates and modifications, making this microcontroller adaptable to changing requirements.

Technical Specifications

Microcontrollers LC87FBK08AU-SSOP-H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

19

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.6 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

LC87FBK08AU-SSOP-H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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