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LC87F7NC8AVUEJ-2H

Onsemi

LC87F7NC8AVUEJ-2H by Onsemi

LC87F7NC8AVUEJ-2H by Onsemi is an 8-bit microcontroller with 131072 ROM words, 4096 RAM bytes, and a max clock frequency of 36 MHz. It is ideal for industrial applications requiring LCD, PWM(2), TIMER(8), WDT peripherals and features 15-Ch 12-Bit ADC channels along with SIO(2) and UART(2) connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,946 parts In-Stock

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Digiode

USA . 377 parts In-Stock

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377

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AZTECH Wire

Italy . 120 parts In-Stock

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$17.820

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120

$17.820

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Component Stockers USA

USA . 427 parts In-Stock

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$99.990

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427

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Problanco Electronics

Mexico . 7,223 parts In-Stock

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SupplyDigital Components

Austria . 7,180 parts In-Stock

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Kulean Microsystems

USA . 7,040 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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TANS Electronics

Latvia . 3,411 parts In-Stock

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Microchip USA

USA . 2,847 parts In-Stock

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UHIMA Technologies

Türkiye . 870 parts In-Stock

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Corphita

USA . 818 parts In-Stock

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Corohmni

South Africa . 486 parts In-Stock

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Overview

Enhance your product designs with the LC87F7NC8AVUEJ-2H microcontroller by Onsemi. With a focus on quality and reliability, Onsemi is a trusted manufacturer known for delivering top-notch components. This microcontroller, with its wide range of applications in various industries, offers unmatched value to customers. From its efficient performance to its advanced features like LCD, PWM, and UART connectivity, this product is designed to bring convenience and innovation to your projects. Upgrade your systems with the LC87F7NC8AVUEJ-2H and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for a wide range of applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply design and allows for compatibility with various voltage sources.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easier to integrate the microcontroller into different types of electronic devices and PCB layouts.

Bit Size: 8

The 8-bit architecture allows for efficient processing of data in a wide range of embedded applications, striking a balance between performance and cost.

No. of Terminals: 100

With a high number of terminals, this microcontroller can easily interface with external components and peripherals, expanding its capabilities.

Package Style (Meter): FLATPACK

The flatpack style of the package offers a low profile design, making it suitable for compact electronic devices where space is a concern.

Minimum Supply Voltage: 2.5 V

The low minimum supply voltage allows for efficient operation in battery-powered applications, extending the device's battery life.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures reliable performance in both extreme cold and hot environments, enhancing the microcontroller's versatility.

Terminal Finish: TIN BISMUTH

The tin bismuth finish provides good solderability and ensures stable connections between the microcontroller and the PCB, improving overall reliability.

Technical Specifications

Microcontrollers LC87F7NC8AVUEJ-2H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

36 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e6

Length:

20 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

89

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

3 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SIO(2), UART(2)

Peripherals:

LCD, PWM(2), TIMER(8), WDT

Analog To Digital Convertors:

15-Ch 12-Bit

Trade Compliance

LC87F7NC8AVUEJ-2H Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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