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LC87F76C8AU-TQFP-E

Onsemi

LC87F76C8AU-TQFP-E by Onsemi

The Onsemi LC87F76C8AU-TQFP-E is an 8-bit microcontroller with 80 terminals, operating at temperatures from -20 to 85 °C. It features a ROM of 131072 words, RAM of 4096 bytes, and PWM channels for various applications requiring precise control and processing capabilities. With a supply voltage range of 3-5.5V, this microcontroller is suitable for diverse electronic projects needing efficient performance in a compact square package.

Median Price

$59.531

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$59.531

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Vyrian

USA . 2,396 parts In-Stock

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Digiode

USA . 740 parts In-Stock

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Bristol Electronics

USA . 119 parts In-Stock

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Dan-Mar Components

USA . 119 parts In-Stock

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AZTECH Wire

Italy . 916 parts In-Stock

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$16.310

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916

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TANS Electronics

Latvia . 7,524 parts In-Stock

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Kulean Microsystems

USA . 5,927 parts In-Stock

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Problanco Electronics

Mexico . 5,657 parts In-Stock

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SupplyDigital Components

Austria . 4,152 parts In-Stock

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Corphita

USA . 1,925 parts In-Stock

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Kepictronics

USA . 1,207 parts In-Stock

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UHIMA Technologies

Türkiye . 351 parts In-Stock

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Microchip USA

USA . 155 parts In-Stock

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Corohmni

South Africa . 88 parts In-Stock

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Overview

Unlock endless possibilities with the LC87F76C8AU-TQFP-E microcontroller by Onsemi. Crafted with precision and innovation, this versatile device offers unmatched performance and reliability for a wide range of applications. Whether you're designing IoT devices, automotive systems, or industrial machinery, this microcontroller delivers exceptional value, efficiency, and functionality. Trust Onsemi's expertise in semiconductor technology to bring your ideas to life with the LC87F76C8AU-TQFP-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides a good balance of durability and cost-effectiveness for the product.

Surface Mount: YES

Allows for easy integration into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Bit Size: 8

Offers a good balance between processing power and complexity for various applications.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the product to interface with analog sensors or signals.

ROM Programmability: FLASH

Enables reprogrammability of the Read-Only Memory, providing flexibility for firmware updates or customization.

RAM Bytes: 4096

Provides sufficient memory for temporary data storage and execution of tasks, enhancing the product's performance.

Speed: 12 rpm

Operates at a moderate speed suitable for a wide range of applications without compromising efficiency.

Technical Specifications

Microcontrollers LC87F76C8AU-TQFP-E attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e6

Length:

12 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

23

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

LC87F76C8AU-TQFP-E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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