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LC87F6D64AU-QFP-E

Onsemi

LC87F6D64AU-QFP-E by Onsemi

LC87F6D64AU-QFP-E by Onsemi is an 8-bit microcontroller with 80 terminals, operating at a max clock frequency of 20 MHz. It features 2048 bytes of RAM and 65536 ROM words, suitable for industrial applications requiring a supply voltage range of 3-5.5 V. With a compact square package style and Gull Wing terminal form, it offers versatile performance in various electronic systems.

Median Price

$3.740

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$3.740

1k+ parts

$3.350

10k+ parts

$3.150

60

-

$3.740

$3.350

$3.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,359 parts In-Stock

1+ parts

$3.962

100+ parts

-

1k+ parts

-

10k+ parts

-

2,359

$3.962

-

-

-

Vyrian

USA . 1,959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,959

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,219 parts In-Stock

1+ parts

$3.753

100+ parts

-

1k+ parts

-

10k+ parts

-

2,219

$3.753

-

-

-

Corohmni

South Africa . 351 parts In-Stock

1+ parts

$4.170

100+ parts

-

1k+ parts

-

10k+ parts

-

351

$4.170

-

-

-

Ampacity Inc.

Singapore . 60 parts In-Stock

1+ parts

$7.710

100+ parts

-

1k+ parts

-

10k+ parts

-

60

$7.710

-

-

-

AZTECH Wire

Italy . 849 parts In-Stock

1+ parts

$17.060

100+ parts

-

1k+ parts

-

10k+ parts

-

849

$17.060

-

-

-

Kulean Microsystems

USA . 8,219 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,219

-

-

-

-

SupplyDigital Components

Austria . 7,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,053

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

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Microchip USA

USA . 1,845 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,845

-

-

-

-

TANS Electronics

Latvia . 1,348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,348

-

-

-

-

UHIMA Technologies

Türkiye . 856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

856

-

-

-

-

Problanco Electronics

Mexico . 290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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290

-

-

-

-

Overview

Unlock endless possibilities with the LC87F6D64AU-QFP-E microcontroller by Onsemi. Crafted with precision and expertise, this powerful device offers unparalleled performance and reliability for a wide range of applications. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, this microcontroller provides the perfect balance of speed, efficiency, and versatility. Experience seamless integration and cutting-edge technology with the LC87F6D64AU-QFP-E, your ultimate solution for innovative projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microcontroller lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V provides flexibility for different power supply configurations and compatibility with various components.

Package Shape: SQUARE

The square package shape helps in easy placement and alignment on the PCB, improving the overall aesthetics and space utilization.

Bit Size: 8

An 8-bit microcontroller is suitable for relatively simpler applications, offering cost-effectiveness and efficiency for smaller-scale projects.

Power Supplies (V): 3/5

Supporting both 3V and 5V power supplies increases compatibility with a wide range of devices and allows for versatile integration in various systems.

No. of Terminals: 80

The abundance of terminals provides connectivity options for multiple peripherals and external components, enhancing the flexibility of the microcontroller.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and efficient heat dissipation, making it suitable for space-constrained applications and high-temperature environments.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement of 3V increases energy efficiency and allows operation in battery-powered devices or low-power applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller can withstand harsh environmental conditions and ensure reliable performance in industrial settings.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40 °C to 85°C enables operation in extreme cold or hot environments, making it suitable for outdoor applications.

Terminal Finish: TIN BISMUTH

The use of tin-bismuth terminal finish enhances solderability and reliability, ensuring stable connections and longevity of the microcontroller.

ADC Channels: YES

The presence of analog-to-digital conversion channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Terminal Position: QUAD

The quad terminal position provides a standardized layout for easy PCB design and assembly, simplifying the manufacturing process and reducing errors.

ROM Words: 65536

The large ROM capacity of 65536 words allows for storing a significant amount of program code and data, accommodating complex algorithms and applications.

Maximum Seated Height: 3 mm

The low maximum seated height of 3mm facilitates compact designs and slim form factors, ideal for applications where space savings are crucial.

Width: 14 mm

The compact width of 14mm makes the microcontroller suitable for designs with limited board space, enabling efficient layout and integration in tight enclosures.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency of 20MHz ensures swift processing speeds and rapid response times, making the microcontroller suitable for real-time applications.

Length: 14 mm

With a length of 14mm, the microcontroller maintains a compact footprint, allowing for versatile placement on the PCB and efficient use of available space.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating signifies robustness and reliability in harsh operating conditions, making this microcontroller suitable for demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with integrated peripherals, this product offers a comprehensive solution for embedded systems, reducing the need for external components and simplifying designs.

RAM Bytes: 2048

The 2048 bytes of RAM provide ample storage for variables and temporary data, enabling efficient multitasking and data manipulation within the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various operating conditions.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and inspection during PCB assembly, ensuring secure connections and streamlined manufacturing processes.

Maximum Supply Current: 32 mA

The maximum supply current of 32mA provides guidelines for power budgeting and ensures proper operation without overloading the power supply, enhancing system stability.

ROM Programmability: FLASH

The flash ROM programmability allows for convenient firmware updates and customization, enabling flexibility in applications and facilitating product enhancements.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65mm enables high-density PCB layouts and precise connections, contributing to compact designs and efficient signal routing.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, the microcontroller is suitable for reflow soldering processes and offers reliability during manufacturing and assembly.

Speed: 10 rpm

The speed rating of 10 rotations per minute indicates the performance capability of the microcontroller in processing instructions and executing tasks efficiently.

No. of I/O Lines: 18

The availability of 18 input/output lines allows for versatile interfacing with external devices and peripherals, enhancing the microcontroller's connectivity and functionality.

Technical Specifications

Microcontrollers LC87F6D64AU-QFP-E attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 2.5 V MIN SUPPLY AT 4 MHZ

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e6

Length:

14 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

18

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

3 mm

Speed:

10 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

32 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LC87F6D64AU-QFP-E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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