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LC87F5VP6AU-QIP-H

Onsemi

LC87F5VP6AU-QIP-H by Onsemi

LC87F5VP6AU-QIP-H by Onsemi is an 8-bit microcontroller with 262144 ROM words, 10240 RAM bytes, and a max clock frequency of 30 MHz. Ideal for industrial applications requiring PWM, TIMER, and WDT peripherals. Operating temperature range from -40 to 85 °C.

Median Price

$3.650

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,250 parts In-Stock

1+ parts

-

100+ parts

$3.140

1k+ parts

$2.810

10k+ parts

$2.650

1,250

-

$3.140

$2.810

$2.650

Farnell

UK . 1,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.650

10k+ parts

-

1,250

-

-

$3.650

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Verical

USA . 1,250 parts In-Stock

1+ parts

-

100+ parts

$3.925

1k+ parts

$3.513

10k+ parts

-

1,250

-

$3.925

$3.513

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,153 parts In-Stock

1+ parts

$3.325

100+ parts

-

1k+ parts

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1,153

$3.325

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-

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Vyrian

USA . 4,248 parts In-Stock

1+ parts

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4,248

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,336 parts In-Stock

1+ parts

$3.150

100+ parts

-

1k+ parts

-

10k+ parts

-

2,336

$3.150

-

-

-

Corohmni

South Africa . 102 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

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10k+ parts

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102

$3.500

-

-

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AZTECH Wire

Italy . 1,178 parts In-Stock

1+ parts

$16.230

100+ parts

-

1k+ parts

-

10k+ parts

-

1,178

$16.230

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$42.801

100+ parts

$38.949

1k+ parts

$35.097

10k+ parts

-

3,000

$42.801

$38.949

$35.097

-

Kulean Microsystems

USA . 7,446 parts In-Stock

1+ parts

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7,446

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TANS Electronics

Latvia . 7,355 parts In-Stock

1+ parts

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7,355

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SupplyDigital Components

Austria . 6,199 parts In-Stock

1+ parts

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6,199

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Problanco Electronics

Mexico . 6,083 parts In-Stock

1+ parts

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6,083

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Microchip USA

USA . 3,089 parts In-Stock

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3,089

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Continental Prestige Electronics

USA . 1,250 parts In-Stock

1+ parts

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100+ parts

$3.650

1k+ parts

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10k+ parts

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1,250

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$3.650

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UHIMA Technologies

Türkiye . 473 parts In-Stock

1+ parts

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473

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Kepictronics

USA . 250 parts In-Stock

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250

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Overview

Enhance your electronic projects with the LC87F5VP6AU-QIP-H microcontroller by Onsemi! Crafted with precision and reliability, this versatile component is designed to elevate your creations to new heights. Whether you're working on robotics, automation, or IoT devices, this microcontroller offers unparalleled performance and efficiency. With a wide range of peripherals, low power consumption, and a robust design, the LC87F5VP6AU-QIP-H is the perfect choice for your next innovation. Experience the quality and innovation that only Onsemi can deliver with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, reducing production time and cost.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Package Shape: RECTANGULAR

Rectangular package shape is standard and easy to accommodate in PCB designs.

Bit Size: 8

8-bit architecture provides sufficient processing power for basic control and automation tasks.

Power Supplies (V): 2.5/5.5

Wide range of power supply options allows for versatile and adaptable use in different environments.

No. of Terminals: 100

Ample number of terminals provide extensive I/O capabilities for connecting to external devices and peripherals.

Package Style (Meter): FLATPACK

Flatpack design enables compact PCB layout and efficient use of space in electronics applications.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures efficient power consumption and operation in battery-powered devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in challenging thermal conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures usability in cold environments or outdoor applications.

Terminal Finish: TIN BISMUTH

TIN BISMUTH terminal finish offers good solderability and reliability in assembly processes.

ADC Channels: YES

Built-in ADC channels enable analog sensor interfacing and data acquisition for diverse applications.

Terminal Position: QUAD

Quad terminal position provides stable mechanical support and electrical connectivity on PCBs.

ROM Words: 262144

Large ROM capacity allows for storing program instructions, data, and configuration settings.

Maximum Seated Height: 3 mm

Low profile design with a maximum seated height of 3mm saves space and facilitates compact device designs.

Width: 14 mm

Narrow width dimension enables space-efficient integration in small electronic enclosures or modules.

Peripherals: PWM(4), TIMER(7), WDT

Multiple peripherals like PWM, timers, and watchdog timer enhance system functionality and real-time operation.

Maximum Clock Frequency: 30 MHz

High clock frequency enables fast data processing and execution of tasks in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands peak reflow temperature for up to 30 seconds, ensuring reliable solder joints during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C meets industry standards for lead-free soldering and assembly processes.

Length: 20 mm

Compact length dimension facilitates space-saving PCB layouts and miniaturization of electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments and extended temperature ranges.

Peripheral IC Type: MICROCONTROLLER

Microcontroller architecture integrates CPU, memory, and I/O peripherals on a single chip for control and automation applications.

RAM Bytes: 10240

Large RAM capacity supports data storage, buffering, and efficient processing of instructions and variables.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance in digital circuits.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and easy soldering during PCB assembly.

Analog To Digital Convertors: 15-Ch 8-Bit

Multiple 8-bit ADC channels enable precise analog signal conversion for sensor inputs and measurement applications.

Maximum Supply Current: 23.5 mA

Low supply current consumption ensures energy-efficient operation and extends battery life in portable devices.

PWM Channels: YES

Pulse Width Modulation (PWM) channels support precise control of analog outputs for motor speed, dimming, and other applications.

Connectivity: SIO(3), UART(2)

Serial I/O and UART interfaces facilitate communication with external devices, sensors, and communication modules.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates, application customization, and data storage on the microcontroller.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm ensures precise soldering and high-density integration in modern PCB designs.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level 3 indicates resistance to moisture absorption during storage and handling, maintaining electrical performance.

Speed: 15 rpm

Operates at a speed of 15 revolutions per minute, suitable for controlling rotational devices or machinery.

On Chip Program ROM Width: 8

On-chip ROM storage width of 8 bits accommodates program instructions, data tables, and configuration settings.

No. of I/O Lines: 81

Numerous I/O lines provide versatile connectivity options for interfacing with peripherals, sensors, and external devices.

Technical Specifications

Microcontrollers LC87F5VP6AU-QIP-H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.5 TO 5.5V @ 8 MHZ

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e6

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

81

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5.5

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

3 mm

Speed:

15 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

23.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SIO(3), UART(2)

Peripherals:

PWM(4), TIMER(7), WDT

Analog To Digital Convertors:

15-Ch 8-Bit

Trade Compliance

LC87F5VP6AU-QIP-H Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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