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LC87F5R96BU-QIP-E

Onsemi

LC87F5R96BU-QIP-E by Onsemi

LC87F5R96BU-QIP-E by Onsemi is an 8-bit microcontroller with 64 terminals, operating at a speed of 24.4 rpm. It features 4096 RAM bytes, 100352 ROM words, and PWM channels for applications requiring precise control such as industrial automation systems. With a temperature range of -40 to 85 °C, this CMOS technology-based microcontroller is suitable for various industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,095 parts In-Stock

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Digiode

USA . 2,257 parts In-Stock

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AZTECH Wire

Italy . 721 parts In-Stock

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$18.180

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721

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Component Stockers USA

USA . 739 parts In-Stock

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$99.990

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739

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Problanco Electronics

Mexico . 6,107 parts In-Stock

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Kulean Microsystems

USA . 5,647 parts In-Stock

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SupplyDigital Components

Austria . 4,006 parts In-Stock

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Microchip USA

USA . 1,650 parts In-Stock

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TANS Electronics

Latvia . 1,441 parts In-Stock

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Corphita

USA . 927 parts In-Stock

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UHIMA Technologies

Türkiye . 686 parts In-Stock

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Corohmni

South Africa . 178 parts In-Stock

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Overview

Discover the power and precision of the LC87F5R96BU-QIP-E microcontroller by Onsemi. With industry-leading quality and reliability, this versatile device is perfect for a wide range of applications. From automation to consumer electronics, this microcontroller delivers unparalleled performance. Experience seamless integration, optimized power management, and advanced features that set this product apart from the competition. Trust in Onsemi's expertise and innovation to take your projects to the next level with the LC87F5R96BU-QIP-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for more efficient PCB design and assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 5.5 V

A high maximum supply voltage allows for versatility in power supply options and compatibility with various components.

Bit Size: 8

8-bit architecture provides sufficient processing power for many embedded applications while keeping costs low.

RAM Bytes: 4096

With 4096 bytes of RAM, the microcontroller can handle complex tasks and store temporary data efficiently.

Technology: CMOS

CMOS technology offers low power consumption, making the microcontroller energy efficient and suitable for battery-operated devices.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog signals, making the microcontroller suitable for motor control and LED dimming applications.

Technical Specifications

Microcontrollers LC87F5R96BU-QIP-E attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e6

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

100352

ROM Programmability:

FLASH

Speed:

24.4 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LC87F5R96BU-QIP-E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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