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LC87F5M64AVU-QIP-E

Onsemi

LC87F5M64AVU-QIP-E by Onsemi

LC87F5M64AVU-QIP-E by Onsemi is an 8-bit microcontroller with 64 terminals, 2.2/5V power supplies, and 2048 RAM bytes. Ideal for industrial applications, it features a FLASH ROM programmability, operating temperature range of -40 to 85 °C, and GULL WING terminal form.

Median Price

$1.762

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$1.660

1k+ parts

$1.490

10k+ parts

$1.400

300

-

$1.660

$1.490

$1.400

Verical

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

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$1.863

10k+ parts

$1.750

300

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$1.863

$1.750

Distributors (In-Stock)

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Digiode

USA . 1,920 parts In-Stock

1+ parts

$1.748

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1,920

$1.748

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Nova Conductors

Japan . 79 parts In-Stock

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$60.606

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79

$60.606

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Vyrian

USA . 5,879 parts In-Stock

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5,879

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Infinite Electronics LLP

India . 209 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 179 parts In-Stock

1+ parts

$1.580

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179

$1.580

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Corphita

USA . 480 parts In-Stock

1+ parts

$1.656

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480

$1.656

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Component Stockers USA

USA . 325 parts In-Stock

1+ parts

$1.910

100+ parts

$1.800

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325

$1.910

$1.800

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AZTECH Wire

Italy . 339 parts In-Stock

1+ parts

$15.080

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339

$15.080

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SupplyDigital Components

Austria . 8,326 parts In-Stock

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Problanco Electronics

Mexico . 8,173 parts In-Stock

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TANS Electronics

Latvia . 5,402 parts In-Stock

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Kulean Microsystems

USA . 2,981 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 600 parts In-Stock

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UHIMA Technologies

Türkiye . 503 parts In-Stock

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503

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Microchip USA

USA . 447 parts In-Stock

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447

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Infinite Electronics LLP (Excess)

. 423 parts In-Stock

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423

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Continental Prestige Electronics

USA . 300 parts In-Stock

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$1.580

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300

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$1.580

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Overview

Unleash the power of innovation with the LC87F5M64AVU-QIP-E by Onsemi. This high-quality microcontroller offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, this versatile device delivers exceptional value and benefits to customers seeking cutting-edge technology. Trust in Onsemi's reputation for excellence and experience the advantages of this advanced microcontroller in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durable and lightweight packaging for the microcontroller.

Surface Mount: YES

Allows for easy installation and soldering onto circuit boards.

Bit Size: 8

Ideal for applications that require lower computational power.

Power Supplies (V): 2.2/5

Offers versatility in power supply options for different applications.

No. of Terminals: 64

Sufficient number of terminals for connecting to other components in the system.

Package Style (Meter): FLATPACK

Space-saving design for compact electronic devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, increasing its versatility.

ROM Words: 65536

Large ROM capacity for storing program instructions and data.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial settings with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for controlling and processing data in embedded systems.

RAM Bytes: 2048

Adequate RAM for temporary data storage and processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering during assembly.

Maximum Supply Current: 18.5 mA

Low supply current requirement helps in efficient power usage.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller.

Terminal Pitch: 0.8 mm

Close terminal pitch for compact layout in densely populated PCBs.

Moisture Sensitivity Level (MSL): 3

Suitable for handling moderate levels of moisture without damage.

Technical Specifications

Microcontrollers LC87F5M64AVU-QIP-E attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

8

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.2/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Sub-Category:

Microcontrollers

Maximum Supply Current:

18.5 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

LC87F5M64AVU-QIP-E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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