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LC87F5M64AU-QIP-E

Onsemi

LC87F5M64AU-QIP-E by Onsemi

LC87F5M64AU-QIP-E by Onsemi is an 8-bit microcontroller with 64 terminals, 2048 RAM bytes, and 65536 ROM words. It operates in industrial temperatures from -40 to 85°C and features FLASH ROM programmability. This microcontroller is suitable for various applications requiring a compact, high-performance solution.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,040 parts In-Stock

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7,040

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Digiode

USA . 1,285 parts In-Stock

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1,285

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

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AZTECH Wire

Italy . 648 parts In-Stock

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$19.582

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648

$19.582

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Ampacity Inc.

Singapore . 818 parts In-Stock

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$35.000

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818

$35.000

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QUARKTWIN TECHNOLOGY LTD

USA . 12,078 parts In-Stock

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12,078

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SupplyDigital Components

Austria . 4,442 parts In-Stock

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4,442

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TANS Electronics

Latvia . 3,516 parts In-Stock

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3,516

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Kulean Microsystems

USA . 2,880 parts In-Stock

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2,880

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Problanco Electronics

Mexico . 1,319 parts In-Stock

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1,319

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 653 parts In-Stock

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653

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Corphita

USA . 636 parts In-Stock

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636

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Metaverse IC Inc.

Canada . 445 parts In-Stock

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445

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Corohmni

South Africa . 289 parts In-Stock

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289

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Microchip USA

USA . 168 parts In-Stock

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168

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Overview

Discover the cutting-edge LC87F5M64AU-QIP-E microcontroller by Onsemi, a game-changer in the industry. With its high-quality construction and advanced technology, this product is sure to exceed your expectations. Perfect for a wide range of applications, from consumer electronics to industrial automation, this microcontroller offers unparalleled performance and reliability. Trust Onsemi's reputation for excellence and experience the value and benefits of this top-of-the-line product for yourself. Elevate your projects with the LC87F5M64AU-QIP-E and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the microcontroller and ensures durability in various operating conditions.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Bit Size: 8

Suitable for applications that do not require a large amount of processing power, making it cost-effective for simpler tasks.

Power Supplies (V): 2.2/5

Offers flexibility in power requirements, making it compatible with a wide range of systems and devices.

No. of Terminals: 64

Provides sufficient input/output options for connecting to external components and peripherals.

Temperature Grade: INDUSTRIAL

Designed to withstand a wide temperature range, making it suitable for industrial applications where temperature variations can occur.

RAM Bytes: 2048

Sufficient memory for storing and manipulating data during operation, allowing for efficient multitasking and processing.

ROM Programmability: FLASH

Enables easy and fast programming of the microcontroller, allowing for quick updates and modifications to the firmware.

Technical Specifications

Microcontrollers LC87F5M64AU-QIP-E attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

8

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.2/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FLASH

Sub-Category:

Microcontrollers

Maximum Supply Current:

18.5 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

LC87F5M64AU-QIP-E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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