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LC87F2J32AU-ED-E

Onsemi

LC87F2J32AU-ED-E by Onsemi

LC87F2J32AU-ED-E by Onsemi is an 8-bit microcontroller with 32768 ROM words and 1024 RAM bytes. It operates in industrial temperature range (-40 to 85 °C) and has a max supply current of 12.7 mA. Ideal for applications requiring low power consumption and high-speed processing in various industries.

Median Price

$2.700

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$2.700

1k+ parts

$2.410

10k+ parts

$2.270

60

-

$2.700

$2.410

$2.270

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 295 parts In-Stock

1+ parts

$2.850

100+ parts

-

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-

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295

$2.850

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-

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Vyrian

USA . 5,981 parts In-Stock

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5,981

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,788 parts In-Stock

1+ parts

$2.700

100+ parts

-

1k+ parts

-

10k+ parts

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1,788

$2.700

-

-

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Corohmni

South Africa . 297 parts In-Stock

1+ parts

$3.000

100+ parts

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297

$3.000

-

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Component Stockers USA

USA . 74 parts In-Stock

1+ parts

$3.050

100+ parts

-

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74

$3.050

-

-

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AZTECH Wire

Italy . 925 parts In-Stock

1+ parts

$14.740

100+ parts

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925

$14.740

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TANS Electronics

Latvia . 8,197 parts In-Stock

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8,197

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SupplyDigital Components

Austria . 7,803 parts In-Stock

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7,803

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Problanco Electronics

Mexico . 6,437 parts In-Stock

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6,437

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Kulean Microsystems

USA . 4,553 parts In-Stock

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4,553

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Microchip USA

USA . 276 parts In-Stock

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276

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UHIMA Technologies

Türkiye . 78 parts In-Stock

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78

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Overview

Unlock the power of innovation with the LC87F2J32AU-ED-E by Onsemi. This high-quality microcontroller offers unparalleled reliability and performance, perfect for a wide range of applications in industries such as automotive, consumer electronics, and industrial automation. With its advanced technology and robust design, this product provides customers with exceptional value, efficiency, and versatility. Experience seamless integration and enhanced functionality with the LC87F2J32AU-ED-E, setting new standards in microcontroller excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in this microcontroller package provides durability and protection, making it suitable for a variety of environments.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and space in the manufacturing process.

Bit Size: 8

An 8-bit microcontroller offers sufficient processing power for many basic applications while being cost-effective.

Power Supplies (V): 2/5

The ability to operate on both 2V and 5V power supplies provides flexibility in designing and integrating this microcontroller into different systems.

No. of Terminals: 48

Having 48 terminals allows for a wide range of connectivity options and peripherals to be interfaced with the microcontroller for enhanced functionality.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact footprint, making it suitable for space-constrained applications while also facilitating heat dissipation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions where temperatures may fluctuate.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for the microcontroller to be used in cold environments without impacting its performance.

ROM Words: 32768

With 32768 ROM words, the microcontroller can store a significant amount of program code, enabling more complex functions and algorithms to be implemented.

RAM Bytes: 1024

Having 1024 bytes of RAM allows for data storage and manipulation during program execution, enhancing the microcontroller's processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various peripheral devices, making it a reliable choice for microcontrollers.

Terminal Form: GULL WING

The gull wing terminal form provides a strong mechanical connection to the PCB, reducing the risk of solder joint failures and ensuring long-term reliability.

Maximum Supply Current: 12.7 mA

The low maximum supply current requirement helps in minimizing power consumption and heat dissipation, making the microcontroller energy-efficient.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the microcontroller's firmware, enhancing flexibility and enabling future enhancements.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting on the PCB, allowing for more compact and lightweight electronic designs.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the microcontroller is moderately sensitive to moisture, requiring proper handling and storage to prevent damage during assembly and operation.

Speed: 12 rpm

The speed of 12 rpm indicates the processing capabilities of the microcontroller, allowing for quick execution of instructions and efficient operation of the attached system.

Technical Specifications

Microcontrollers LC87F2J32AU-ED-E attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

8

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.7 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC87F2J32AU-ED-E Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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