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LC87F2G08AUMJ-ZH

Onsemi

LC87F2G08AUMJ-ZH by Onsemi

LC87F2G08AUMJ-ZH by Onsemi is an 8-bit microcontroller with 8192 ROM words and 256 RAM bytes. It operates in industrial temperature range (-40 to 85 °C) and has a max supply current of 16.2 mA. Ideal for applications requiring small outline, shrink pitch packages with dual terminal position.

Median Price

$1.475

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$1.450

1k+ parts

$1.200

10k+ parts

$1.070

9,000

-

$1.450

$1.200

$1.070

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.500

10k+ parts

-

4,000

-

-

$1.500

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 337 parts In-Stock

1+ parts

$1.130

100+ parts

-

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-

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337

$1.130

-

-

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Vyrian

USA . 4,673 parts In-Stock

1+ parts

-

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-

1k+ parts

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4,673

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 393 parts In-Stock

1+ parts

$1.060

100+ parts

-

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-

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393

$1.060

-

-

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Corphita

USA . 289 parts In-Stock

1+ parts

$1.071

100+ parts

-

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-

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289

$1.071

-

-

-

Component Stockers USA

USA . 21,137 parts In-Stock

1+ parts

$1.210

100+ parts

$1.140

1k+ parts

$1.030

10k+ parts

-

21,137

$1.210

$1.140

$1.030

-

AZTECH Wire

Italy . 628 parts In-Stock

1+ parts

$18.880

100+ parts

-

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10k+ parts

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628

$18.880

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$21.745

100+ parts

$19.788

1k+ parts

$17.831

10k+ parts

-

2,500

$21.745

$19.788

$17.831

-

Infinite Electronics LLP (Excess)

. 10,001 parts In-Stock

1+ parts

-

100+ parts

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10,001

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Continental Prestige Electronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$1.430

1k+ parts

-

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9,000

-

$1.430

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SupplyDigital Components

Austria . 8,224 parts In-Stock

1+ parts

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8,224

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TANS Electronics

Latvia . 7,181 parts In-Stock

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7,181

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Kepictronics

USA . 7,000 parts In-Stock

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7,000

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Problanco Electronics

Mexico . 6,772 parts In-Stock

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6,772

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Kulean Microsystems

USA . 6,392 parts In-Stock

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6,392

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Assy Fe

Spain . 1,520 parts In-Stock

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1,520

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UHIMA Technologies

Türkiye . 972 parts In-Stock

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972

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Microchip USA

USA . 485 parts In-Stock

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485

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Overview

Experience the exceptional quality and performance of the LC87F2G08AUMJ-ZH microcontroller by Onsemi. With a reputation for reliability and innovation, Onsemi ensures that their products meet the highest standards in the industry. This versatile microcontroller is ideal for a wide range of applications, offering customers valuable benefits such as efficient power management, compact design, and reliable operation in industrial environments. Discover the advantages of Onsemi's LC87F2G08AUMJ-ZH and unlock the potential for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes it easier to integrate the microcontroller onto PCBs, reducing assembly time and costs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, optimizing the layout and design of the overall system.

Bit Size: 8

8-bit architecture is suitable for a wide range of applications, providing a good balance between performance and cost.

Power Supplies (V): 2/5

Support for multiple voltage supplies allows for flexibility in power configurations, making it versatile for various projects.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for interfacing with other components and peripherals in the system.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space on the PCB, making it suitable for compact designs and applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, ensuring reliability in various settings.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the microcontroller to operate in both extreme cold and hot conditions, making it versatile for different environments.

Terminal Finish: Tin/Silver (Sn/Ag)

Tin/silver terminal finish provides good conductivity and corrosion resistance, ensuring stable connections for optimal performance.

Terminal Position: DUAL

Dual terminal position allows for easier PCB routing and layout, enhancing the overall design efficiency of the system.

ROM Words: 8192

With 8192 ROM words, this microcontroller can store a significant amount of program code and data, suitable for complex applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in challenging industrial environments, making it a robust choice for industrial applications.

RAM Bytes: 256

256 bytes of RAM provide sufficient memory for temporary data storage and manipulation, supporting efficient operation of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and assembly processes, ensuring a reliable connection between the microcontroller and the PCB.

Maximum Supply Current: 16.2 mA

Low maximum supply current ensures energy efficiency and minimizes power consumption, making it suitable for battery-powered applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick reprogramming of the microcontroller, supporting iterative development and flexibility in project designs.

Terminal Pitch: 1 mm

Compact 1mm terminal pitch enables high-density mounting, saving space on the PCB and facilitating tight component placement for compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microcontroller has moderate sensitivity to moisture, which is suitable for standard reflow soldering processes in manufacturing.

Technical Specifications

Microcontrollers LC87F2G08AUMJ-ZH attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

8

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e2

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.3,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Sub-Category:

Microcontrollers

Maximum Supply Current:

16.2 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver (Sn/Ag)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LC87F2G08AUMJ-ZH Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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