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LC87F2608AUMM-AH

Onsemi

LC87F2608AUMM-AH by Onsemi

LC87F2608AUMM-AH by Onsemi is an 8-bit microcontroller with 512 bytes of RAM and 8192 ROM words. It operates at a speed of 43.2 rpm, suitable for industrial applications requiring PWM channels and ADC functionality. With a small outline package style and dual terminal position, it offers versatile integration options in compact designs.

Median Price

$1.040

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,000 parts In-Stock

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$1.040

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$1.040

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$1.040

$1.040

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Flip Electronics

USA . 1,000 parts In-Stock

1+ parts

$0.780

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$0.780

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Vyrian

USA . 4,422 parts In-Stock

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Chip Stock

USA . 3,500 parts In-Stock

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Digiode

USA . 1,719 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 137 parts In-Stock

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$1.040

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137

$1.040

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Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$19.092

100+ parts

$17.374

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$15.655

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900

$19.092

$17.374

$15.655

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Component Stockers USA

USA . 744 parts In-Stock

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$99.990

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744

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 12,234 parts In-Stock

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TANS Electronics

Latvia . 7,385 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 4,119 parts In-Stock

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Problanco Electronics

Mexico . 3,517 parts In-Stock

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SupplyDigital Components

Austria . 2,611 parts In-Stock

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Microchip USA

USA . 477 parts In-Stock

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477

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Corphita

USA . 375 parts In-Stock

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Metaverse IC Inc.

Canada . 340 parts In-Stock

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Kepictronics

USA . 240 parts In-Stock

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UHIMA Technologies

Türkiye . 144 parts In-Stock

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144

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Overview

Enhance your electronic projects with the LC87F2608AUMM-AH microcontroller by Onsemi! With a reputation for quality and innovation, Onsemi delivers top-notch products that are reliable and efficient. The LC87F2608AUMM-AH falls into the microcontrollers category, making it ideal for a wide range of applications. This versatile microcontroller offers customers exceptional value, benefits, and advantages, allowing them to create cutting-edge designs with ease. Trust Onsemi to provide you with the tools you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this microcontroller lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Capability to handle a maximum supply voltage of 5.5V provides flexibility in power supply options for various applications.

Minimum Supply Voltage: 2.7 V

With a minimum supply voltage of 2.7V, this microcontroller can operate efficiently even with lower power sources.

Bit Size: 8

The 8-bit architecture of this microcontroller allows for processing and handling of data in 8-bit chunks, suitable for many applications.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, this product contains integrated peripherals and memory, making it a standalone computing device suitable for embedded systems.

RAM Bytes: 512

With 512 bytes of RAM, this microcontroller can store and process data efficiently during operation.

ROM Programmability: FLASH

The use of flash ROM allows for the reprogramming of the memory, enabling updates and modifications to the firmware of the microcontroller.

Technical Specifications

Microcontrollers LC87F2608AUMM-AH attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e6

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

8

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

43.2 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

14 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

LC87F2608AUMM-AH Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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