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LC87F1HC8AUWA-2H

Onsemi

LC87F1HC8AUWA-2H by Onsemi

LC87F1HC8AUWA-2H by Onsemi is an 8-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It operates in industrial temperatures (-40 to 85 °C) and has a max supply voltage of 5.5V, making it suitable for various applications requiring precise control and data processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 18,000 parts In-Stock

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Vyrian

USA . 8,644 parts In-Stock

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Digiode

USA . 696 parts In-Stock

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AZTECH Wire

Italy . 1,154 parts In-Stock

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Kulean Microsystems

USA . 7,630 parts In-Stock

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Problanco Electronics

Mexico . 7,426 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,012 parts In-Stock

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SupplyDigital Components

Austria . 5,643 parts In-Stock

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TANS Electronics

Latvia . 4,229 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,008 parts In-Stock

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Kepictronics

USA . 1,500 parts In-Stock

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Corphita

USA . 1,454 parts In-Stock

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Microchip USA

USA . 1,025 parts In-Stock

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UHIMA Technologies

Türkiye . 823 parts In-Stock

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Corohmni

South Africa . 81 parts In-Stock

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Overview

Discover the power and precision of the LC87F1HC8AUWA-2H microcontroller by Onsemi, a leader in cutting-edge technology. With a compact square package and versatile terminal layout, this device is ideal for a wide range of applications. From automotive systems to industrial automation, this microcontroller offers unparalleled performance and reliability. Experience seamless integration and efficient operation with the LC87F1HC8AUWA-2H, delivering exceptional value and innovation to customers seeking top-quality solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material is durable and cost-effective, making this microcontroller a reliable choice for various applications.

Surface Mount: YES

Being surface mountable, this microcontroller can be easily integrated onto a PCB, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller can handle a wide range of power inputs, providing flexibility in design.

Bit Size: 8

The 8-bit architecture of this microcontroller allows for efficient processing and control of data, suitable for many embedded applications.

Power Supplies (V): 3/5

Supporting multiple power supply options of 3V and 5V, this microcontroller can be easily integrated into existing systems with different voltage requirements.

No. of Terminals: 48

With 48 terminals, this microcontroller offers plenty of I/O options for connecting to external devices and sensors, enhancing its versatility.

RAM Bytes: 16384

The large RAM size of 16,384 bytes provides ample space for storing data and variables, enabling efficient multitasking and data processing.

Technology: CMOS

Utilizing CMOS technology, this microcontroller offers low power consumption and high noise immunity, ensuring reliable operation in various environments.

PWM Channels: YES

Supporting PWM channels allows for precise control of analog components such as motors and LEDs, making this microcontroller ideal for projects requiring dynamic control.

ADC Channels: YES

With ADC channels, this microcontroller can convert analog signals from sensors into digital data, expanding its capability to interface with a wide range of sensors.

Technical Specifications

Microcontrollers LC87F1HC8AUWA-2H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e6

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LC87F1HC8AUWA-2H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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