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LC87F1D64AUWA-2H

Onsemi

LC87F1D64AUWA-2H by Onsemi

LC87F1D64AUWA-2H by Onsemi is an 8-bit microcontroller with 48 terminals, 65536 ROM words, and 4096 RAM bytes. It operates b/w -30 to 70 °C and has a max supply voltage of 5.5V. Ideal for applications requiring PWM channels, ADC channels, and a compact square package style with low profile design.

Median Price

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Lifecycle Status

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3

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1k+

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Chip Stock

USA . 63,000 parts In-Stock

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AZTECH Wire

Italy . 791 parts In-Stock

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Microchip USA

USA . 5,768 parts In-Stock

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SupplyDigital Components

Austria . 5,925 parts In-Stock

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Kulean Microsystems

USA . 3,737 parts In-Stock

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Problanco Electronics

Mexico . 2,763 parts In-Stock

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TANS Electronics

Latvia . 1,727 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 728 parts In-Stock

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Overview

Experience the cutting-edge technology of the LC87F1D64AUWA-2H microcontroller from Onsemi. With a focus on quality and reliability, Onsemi is a trusted manufacturer in the industry. This versatile microcontroller is perfect for a wide range of applications, offering customers value and benefits like precise control, increased efficiency, and seamless integration. Trust Onsemi for top-notch products that deliver exceptional performance and innovation. Elevate your projects with the LC87F1D64AUWA-2H microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the microcontroller, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology makes it easier to mount and solder the microcontroller onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller can handle high voltage inputs, making it versatile for a wide range of applications.

Package Shape: SQUARE

The square package shape allows for easy placement and orientation on the circuit board, simplifying the design and layout process.

Bit Size: 8

An 8-bit microcontroller offers sufficient processing power for many embedded systems and IoT applications, making it a cost-effective choice for various projects.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies allows flexibility in power options, enabling compatibility with a wide range of external devices and components.

No. of Terminals: 48

With 48 terminals, this microcontroller offers plenty of I/O options for connecting to external sensors, actuators, and peripherals, enhancing the functionality of the product.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style helps in reducing the overall size of the microcontroller, making it suitable for compact and space-constrained designs.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V ensures compatibility with a wide range of power sources, making it easier to integrate the microcontroller into different systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this microcontroller can withstand higher temperature environments, increasing its reliability in various applications.

Minimum Operating Temperature: -30 °C

The ability to operate at temperatures as low as -30 °C makes this microcontroller suitable for use in cold environments or outdoor applications where temperature fluctuations are common.

Terminal Finish: TIN BISMUTH

Tin bismuth terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term performance of the microcontroller.

ADC Channels: YES

The presence of analog-to-digital converter channels allows the microcontroller to interface with analog sensors and signals, expanding its capabilities for sensing and control applications.

Terminal Position: QUAD

Quad terminal position offers ease of connectivity and soldering, simplifying the assembly process and ensuring a secure connection between the microcontroller and the circuit board.

ROM Words: 65536

With a ROM capacity of 65536 words, this microcontroller can store a large amount of program code and data, enabling complex applications and algorithms to be implemented.

Width: 7 mm

The compact width of 7mm makes this microcontroller suitable for small form factor designs, where space-saving is a priority without compromising on performance.

Length: 7 mm

The length of 7mm contributes to the overall compactness of the microcontroller, allowing for easy integration into tight spaces or applications where size constraints are a concern.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates essential peripherals and control functions in a single chip, simplifying design complexity and reducing component count in embedded systems.

RAM Bytes: 4096

With 4096 bytes of RAM, this microcontroller provides sufficient memory for data storage and processing, supporting multitasking and efficient operation of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable for battery-operated devices or power-sensitive applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and inspection of solder joints, ensuring good electrical connections and reliability in the assembly of the microcontroller onto the circuit board.

Maximum Supply Current: 40 mA

A maximum supply current of 40mA indicates low power consumption of the microcontroller, making it suitable for battery-powered devices or applications where power efficiency is crucial.

PWM Channels: YES

The presence of pulse-width modulation channels allows for precise control of analog signals and power delivery, enabling the microcontroller to drive motors, actuators, and LED brightness with accuracy.

ROM Programmability: FLASH

Flash ROM programmability enables easy updates and modifications to the program code stored in the microcontroller, facilitating firmware upgrades and bug fixes without the need for external programming tools.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm provides high density and fine pitch for the connections, allowing for compact designs and efficient use of space on the PCB layout.

Moisture Sensitivity Level (MSL): 4

A moisture sensitivity level of 4 indicates the level of protection required during storage and handling to prevent moisture-related damage, ensuring the reliability and performance of the microcontroller in various environments.

Speed: 16 rpm

With a speed rating of 16 rpm, this microcontroller is capable of executing instructions and processing data at a fast pace, enabling quick response times and efficient operation in real-time applications.

No. of I/O Lines: 36

The availability of 36 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, allowing for versatile and expandable functionality in different applications.

Technical Specifications

Microcontrollers LC87F1D64AUWA-2H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e6

Length:

7 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LC87F1D64AUWA-2H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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