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LC87F0N04AUJD-H

Onsemi

LC87F0N04AUJD-H by Onsemi

LC87F0N04AUJD-H by Onsemi is an 8-bit microcontroller with a clock frequency of 10 MHz, suitable for industrial applications. It features 12 I/O lines, PWM channels, and ADC channels. With a compact rectangular package style and dual terminal position, it operates in temperatures ranging from -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,294 parts In-Stock

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Digiode

USA . 935 parts In-Stock

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AZTECH Wire

Italy . 963 parts In-Stock

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$18.030

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SupplyDigital Components

Austria . 7,368 parts In-Stock

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Problanco Electronics

Mexico . 5,779 parts In-Stock

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Microchip USA

USA . 3,525 parts In-Stock

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Kulean Microsystems

USA . 3,468 parts In-Stock

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TANS Electronics

Latvia . 949 parts In-Stock

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Corphita

USA . 491 parts In-Stock

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UHIMA Technologies

Türkiye . 401 parts In-Stock

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Corohmni

South Africa . 358 parts In-Stock

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Overview

Unleash the power of innovation with the LC87F0N04AUJD-H microcontroller by Onsemi. Crafted with precision and quality, this small outline, low profile device offers unmatched performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller with 8-bit processing capability and flash ROM programmability delivers seamless operation at a maximum clock frequency of 10 MHz. Experience the benefits of advanced technology and exceptional value with Onsemi's cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options and compatibility with a wide range of systems.

Bit Size: 8

Offers sufficient processing power for a variety of applications while keeping the design simple and cost-effective.

ADC Channels: YES

Enables analog-to-digital conversion, making the microcontroller suitable for sensor interfacing and data acquisition applications.

ROM Programmability: FLASH

Allows for easy programming and updating of firmware, ensuring adaptability and future-proofing of the product.

Technical Specifications

Microcontrollers LC87F0N04AUJD-H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

10 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Length:

5.2 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

12

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

ROM Words:

4608

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

10 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

LC87F0N04AUJD-H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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