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LC75832WS-E

Onsemi

LC75832WS-E by Onsemi

LC75832WS-E by Onsemi is a Graphics Display Driver with SEGMENT display mode and SERIAL data input. It operates at 2.7-6V, has 108 segments, and is ideal for industrial LCD driver applications due to its CMOS technology and low profile design.

Median Price

$1.314

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,290 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.040

1,290

-

$1.240

$1.110

$1.040

Verical

USA . 1,290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.387

10k+ parts

$1.300

1,290

-

-

$1.387

$1.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 54 parts In-Stock

1+ parts

$1.302

100+ parts

-

1k+ parts

-

10k+ parts

-

54

$1.302

-

-

-

Vyrian

USA . 2,780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,780

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 272 parts In-Stock

1+ parts

$1.233

100+ parts

-

1k+ parts

-

10k+ parts

-

272

$1.233

-

-

-

Corohmni

South Africa . 142 parts In-Stock

1+ parts

$1.370

100+ parts

-

1k+ parts

-

10k+ parts

-

142

$1.370

-

-

-

AZTECH Wire

Italy . 954 parts In-Stock

1+ parts

$13.410

100+ parts

-

1k+ parts

-

10k+ parts

-

954

$13.410

-

-

-

Problanco Electronics

Mexico . 8,191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,191

-

-

-

-

SupplyDigital Components

Austria . 7,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,347

-

-

-

-

Kulean Microsystems

USA . 6,413 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

6,413

-

-

-

-

Component Connect

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

TANS Electronics

Latvia . 1,469 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,469

-

-

-

-

Microchip USA

USA . 484 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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484

-

-

-

-

UHIMA Technologies

Türkiye . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Overview

Unlocking a world of vibrant and dynamic visuals, the LC75832WS-E by Onsemi is a game-changer in the realm of Graphics Display Drivers. With a focus on quality and innovation, Onsemi delivers cutting-edge technology that exceeds expectations. Perfect for applications requiring high-quality segment display modes and serial data input, this product offers unmatched value and performance. Elevate your projects with the LC75832WS-E and experience the difference that superior technology can make.

Feature Benefit Bullets

Display Mode: SEGMENT

Allows for clear and segmented display of information, ideal for applications where specific data needs to be easily readable.

Data Input Mode: SERIAL

Serial data input mode ensures efficient and reliable communication with other devices, making it suitable for integration into larger systems.

Surface Mount: YES

Surface mount capability allows for easy and compact installation on circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 6 V

Higher supply voltage tolerance ensures stability and reliability of the device, making it suitable for a wide range of power supply configurations.

Package Shape: SQUARE

Square package shape provides a compact form factor, enabling efficient use of space on a PCB and facilitating easier handling during assembly.

Power Supplies (V): 3/5

Supports dual power supply configurations (3V and 5V), offering flexibility in system design and compatibility with different voltage levels.

No. of Terminals: 64

With 64 terminals, the device can accommodate a variety of input and output connections, making it versatile for interfacing with external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style allows for compact and dense mounting on the PCB, reducing board space requirements and enhancing reliability.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage ensures compatibility with a wide range of power sources and enhances energy efficiency in operation.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance enables reliable performance in harsh environmental conditions, ensuring the device's durability and longevity.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions, making the device suitable for diverse applications across different environments.

Terminal Finish: TIN BISMUTH

Tin bismuth terminal finish provides excellent solderability and corrosion resistance, improving the device's reliability and longevity in various operating environments.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connection to the PCB, enhancing stability and reliability during installation and use.

Maximum Seated Height: 1.7 mm

Low maximum seated height allows for a thinner profile and more compact design, making it suitable for applications with space constraints.

Width: 10 mm

Compact width dimension enables efficient board layout and space-saving integration, making the device suitable for small form factor applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a peak reflow temperature time of 30 seconds, the device can withstand high-temperature soldering processes, ensuring reliable assembly and connection.

Peak Reflow Temperature °C: 260

High peak reflow temperature capacity allows for reliable and robust soldering during assembly, ensuring long-term performance and durability of the device.

Length: 10 mm

Compact length dimension contributes to overall space-efficient design and easy integration into various applications with limited space availability.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments, making the device suitable for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, making it an efficient and versatile choice for electronic devices.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and enhances mechanical strength, ensuring secure and reliable connections to the PCB for long-lasting performance.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable power delivery to the device, supporting optimal performance in various operating conditions.

No. of Segments: 108

With 108 segments, the device can display a wide range of information or graphics, making it suitable for applications requiring detailed and extensive visual output.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm enables high-density mounting on the PCB, maximizing board space utilization and allowing for compact system designs.

Nominal Supply Voltage-1: 5 V

Additional nominal supply voltage option of 5V provides flexibility in power supply configuration, accommodating different voltage requirements and ensuring compatibility with various systems.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the device can withstand moderate exposure to moisture during storage or handling, ensuring long-term reliability in varying environmental conditions.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

Designed specifically for driving liquid crystal display interfaces, ensuring seamless communication and control of LCD screens for high-quality visual output in different applications.

Technical Specifications

Graphics Display Drivers LC75832WS-E attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

S-XQFP-G64

JESD-609 Code:

e6

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Backplanes:

2-BP

No. of Functions:

1

No. of Segments:

108

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

6 V

Minimum Supply Voltage-1:

2.7 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

LC75832WS-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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