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SAA1064T/N2,112

NXP Semiconductors

SAA1064T/N2,112 by NXP Semiconductors

NXP Semiconductors' SAA1064T/N2,112 is a 24-terminal LED display driver with serial data input mode and totem-pole output. It operates in industrial temperature range (-40 to 85 °C) with multiplexed display capability for 4-digit segments. Ideal for graphics displays, it supports a max supply voltage of 15 V and requires only 14 mA max supply current.

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Vyrian

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Infinite Electronics LLP

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Digiode

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Nova Conductors

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Goldney Electronics S.L.

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AZTECH Wire

Italy . 499 parts In-Stock

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Corohmni

South Africa . 566 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,827 parts In-Stock

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Microchip USA

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Semicontronic

India . 2,336 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Lixinc

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Argo Parts USA

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Continental Prestige Electronics

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Overview

Elevate your display experience with the SAA1064T/N2,112 by NXP Semiconductors. Designed for top-notch performance in graphics display drivers, this product offers unparalleled quality and reliability. Perfect for a wide range of applications, this LED display driver boasts a sleek design and seamless functionality. Say goodbye to complicated setups and hello to effortless integration. Experience the difference with NXP Semiconductors - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the display driver, ensuring a longer lifespan.

Display Mode: SEGMENT

Segment display mode offers clear and easy-to-read output, making it suitable for various display applications.

Data Input Mode: SERIAL

Serial data input mode allows for efficient communication and data transfer, enhancing overall performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this display driver is suitable for industrial applications where heat resistance is crucial.

No. of Segments: 16

Having 16 segments enables the display driver to show more detailed information or graphics, providing versatility in display options.

Technical Specifications

Graphics Display Drivers SAA1064T/N2,112 attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

YES

No. of Digits/Characters:

4-DIGIT

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

14 mA

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SAA1064T/N2,112 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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