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LC75832ES-E

Onsemi

LC75832ES-E by Onsemi

LC75832ES-E by Onsemi is a Graphics Display Driver with 108 segments, operating at -40 to 105 °C. It has SERIAL data input mode, 64 terminals, and supports SEGMENT display mode. Ideal for industrial applications requiring liquid crystal display drivers.

Median Price

$2.180

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$2.180

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300

$2.180

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Vyrian

USA . 3,198 parts In-Stock

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3,198

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Digiode

USA . 812 parts In-Stock

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812

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NexGen Digital

USA . 240 parts In-Stock

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240

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,203 parts In-Stock

1+ parts

$2.180

100+ parts

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1k+ parts

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10k+ parts

$2.136

2,203

$2.180

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-

$2.136

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.180

100+ parts

-

1k+ parts

$2.071

10k+ parts

$2.027

1,000

$2.180

-

$2.071

$2.027

Argo Parts USA

USA . 770 parts In-Stock

1+ parts

$2.180

100+ parts

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770

$2.180

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AZTECH Wire

Italy . 258 parts In-Stock

1+ parts

$17.415

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258

$17.415

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Semicontronic

India . 720 parts In-Stock

1+ parts

$38.500

100+ parts

$37.538

1k+ parts

$37.345

10k+ parts

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720

$38.500

$37.538

$37.345

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Ampacity Inc.

Singapore . 1,189 parts In-Stock

1+ parts

$50.500

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1,189

$50.500

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Kulean Microsystems

USA . 8,209 parts In-Stock

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8,209

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TANS Electronics

Latvia . 6,564 parts In-Stock

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6,564

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Problanco Electronics

Mexico . 5,261 parts In-Stock

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5,261

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,033 parts In-Stock

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2,033

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SupplyDigital Components

Austria . 1,515 parts In-Stock

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1,515

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UHIMA Technologies

Türkiye . 788 parts In-Stock

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788

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Microchip USA

USA . 184 parts In-Stock

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184

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Corohmni

South Africa . 152 parts In-Stock

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152

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Overview

Elevate your displays with the LC75832ES-E by Onsemi, a top-tier manufacturer known for quality and innovation. This Graphics Display Driver offers seamless integration for SEGMENT display mode, making it perfect for a wide range of applications. With its SERIAL data input mode and compact SQUARE package shape, this driver ensures maximum efficiency and performance. Trust in Onsemi's expertise and elevate your projects to new heights with the LC75832ES-E. Unlock unparalleled value and benefits for your customers today!

Feature Benefit Bullets

Display Mode: SEGMENT

This display mode allows for easy segment control and organization, making it ideal for various types of displays.

Data Input Mode: SERIAL

The serial data input mode allows for efficient and simplified communication with the driver, enhancing overall system performance.

Surface Mount: YES

The surface mount feature makes installation and integration easier, saving time and effort during assembly.

Maximum Supply Voltage: 6 V

With a higher maximum supply voltage, this driver can accommodate a wide range of input voltages, improving compatibility with different systems.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, allowing for more flexibility in layout and placement.

Power Supplies (V): 3/5

Supporting dual power supplies at 3V and 5V allows for greater flexibility in power management and compatibility with various components.

No. of Terminals: 64

Having a higher number of terminals enables more connectivity options and functionality, making it versatile for different display applications.

Package Style (Meter): FLATPACK

The flatpack package style offers durability and ease of handling, ensuring reliable performance and installation convenience.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement makes this driver energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature tolerance ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance allows for reliable operation in cold environments, making it suitable for various applications.

Terminal Finish: TIN BISMUTH

The use of tin bismuth terminal finish provides good solderability and resistance to environmental factors, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position layout allows for efficient soldering and connection, enhancing ease of assembly and reliability.

Maximum Seated Height: 3 mm

The low maximum seated height contributes to a compact and slim design, suitable for space-constrained applications.

Width: 14 mm

The width dimension provides a balance between space efficiency and component stability, making it suitable for various mounting configurations.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum reflow time ensures proper soldering and component integrity during assembly, reducing the risk of damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering in lead-free processes, ensuring strong and durable connections.

Length: 14 mm

The length dimension offers a compact form factor, ideal for integration into various display systems with limited space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable performance in a wide range of temperature conditions, suitable for industrial applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, contributing to efficient operation and reliable performance.

Terminal Form: GULL WING

The gull wing terminal form provides secure connection and robustness, ensuring stable performance in demanding applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V offers compatibility with various power sources and components, enhancing system integration.

No. of Segments: 108

Supporting a high number of segments allows for detailed and customizable display configurations, making it suitable for varied display requirements.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for compact connection and efficient board layout, optimizing space utilization and signal integrity.

Nominal Supply Voltage-1: 5 V

Having a nominal supply voltage of 5V offers compatibility and versatility in power supply options, making it suitable for a wide range of applications.

Moisture Sensitivity Level (MSL): 4

The MSL level of 4 indicates robustness against moisture and environmental factors, ensuring long-term reliability and performance stability.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

The interface IC type specifically designed for liquid crystal display drivers ensures optimized communication and control for enhanced display performance.

Technical Specifications

Graphics Display Drivers LC75832ES-E attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

S-XQFP-G64

JESD-609 Code:

e6

Length:

14 mm

Moisture Sensitivity Level (MSL):

4

Multiplexed Display Capability:

NO

No. of Backplanes:

2-BP

No. of Functions:

1

No. of Segments:

108

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

QFP

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

3 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

6 V

Minimum Supply Voltage-1:

2.7 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

LC75832ES-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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