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LC75806PTS-H

Onsemi

LC75806PTS-H by Onsemi

LC75806PTS-H by Onsemi is a graphics display driver with 304 segments, operating at 5V. It features a serial data input mode, 3-state output characteristics, and supports segment display mode. Ideal for industrial applications requiring a thin profile package with fine pitch terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,808 parts In-Stock

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Vyrian

USA . 1,225 parts In-Stock

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1,225

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,246 parts In-Stock

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SupplyDigital Components

Austria . 4,040 parts In-Stock

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TANS Electronics

Latvia . 3,731 parts In-Stock

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Corphita

USA . 1,943 parts In-Stock

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Problanco Electronics

Mexico . 1,183 parts In-Stock

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Corohmni

South Africa . 277 parts In-Stock

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UHIMA Technologies

Türkiye . 114 parts In-Stock

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Overview

Revolutionize your display experience with the LC75806PTS-H by Onsemi. As a leading manufacturer in graphics display drivers, Onsemi delivers top-notch quality and reliability. This versatile driver offers seamless integration with its serial data input mode and segment display mode. Ideal for industrial applications, this product boasts a wide operating temperature range and low power consumption. Upgrade your designs with the LC75806PTS-H and enjoy unparalleled performance and efficiency. Unlock the potential of your displays today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and long-lasting use.

Display Mode: SEGMENT

Segment display provides clear and easy-to-read information for users.

Data Input Mode: SERIAL

Serial input mode allows for efficient communication and data transfer.

Surface Mount: YES

Surface mount design enables easy installation and space-saving on circuit boards.

Maximum Supply Voltage: 6 V

Supports a wide range of supply voltage for versatile applications.

No. of Terminals: 100

Provides ample connection points for seamless integration with other components.

Maximum Operating Temperature: 85 °C

Capable of operating in high temperature environments for reliable performance.

Output Characteristics: 3-STATE

3-state output allows for flexible control and signal routing.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Technical Specifications

Graphics Display Drivers LC75806PTS-H attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e6

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Backplanes:

4-BP

No. of Functions:

1

No. of Segments:

304

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

2.8 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

LC75806PTS-H Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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