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LC75725E

Onsemi

LC75725E by Onsemi

LC75725E by Onsemi is a CMOS graphics display driver with 64 terminals in a square flatpack package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It requires 5V nominal voltage and has a max supply current of 5mA, making it ideal for various display applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 21,675 parts In-Stock

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Vyrian

USA . 2,480 parts In-Stock

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Extreme Components

USA . 1,000 parts In-Stock

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Digiode

USA . 571 parts In-Stock

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Kulean Microsystems

USA . 7,619 parts In-Stock

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7,619

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TANS Electronics

Latvia . 5,601 parts In-Stock

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Problanco Electronics

Mexico . 5,476 parts In-Stock

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Kepictronics

USA . 3,720 parts In-Stock

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3,720

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Corphita

USA . 845 parts In-Stock

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SupplyDigital Components

Austria . 579 parts In-Stock

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Corohmni

South Africa . 225 parts In-Stock

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UHIMA Technologies

Türkiye . 100 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the LC75725E by Onsemi. As a leading manufacturer in the industry, Onsemi is renowned for its superior quality and reliability. The LC75725E falls under the category of Graphics Display Drivers, making it an essential component for a wide range of applications. With a package body material of PLASTIC/EPOXY and a surface mount design, this product offers unmatched value and benefits. Experience seamless performance and efficiency with the LC75725E, providing customers with a competitive edge in today's fast-paced market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and cost-effective solution for the product.

Surface Mount: YES

Enables easy and efficient installation onto a circuit board.

Package Shape: SQUARE

Helps in proper alignment and positioning of the driver on the board.

Power Supplies (V): 5

Operates at a standard voltage which is commonly available in electronic systems.

No. of Terminals: 64

Provides sufficient connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK

Facilitates easy integration and space-saving design.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Allows the driver to function in extreme cold conditions without any issues.

Terminal Position: QUAD

Enables efficient connectivity and signal flow within the system.

Temperature Grade: INDUSTRIAL

Suitable for use in rugged industrial settings where temperature fluctuations are common.

Technology: CMOS

Provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Ensures secure and reliable connections on the circuit board.

Maximum Supply Current: 5 mA

Operates within a low current range to prevent overheating and damage.

Nominal Supply Voltage: 5 V

Matches the standard voltage requirements of most electronic systems.

Terminal Pitch: 0.8 mm

Provides adequate spacing for easy soldering and maintenance.

Technical Specifications

Graphics Display Drivers LC75725E attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Maximum Supply Current:

5 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LC75725E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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