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LC75805PES-3H

Onsemi

LC75805PES-3H by Onsemi

LC75805PES-3H by Onsemi is a Graphics Display Driver with 38 segments, operating at 5V. It features CMOS technology, GULL WING terminals, and a max supply current of 1.5mA. Ideal for Liquid Crystal Displays in industrial applications due to its wide temperature range (-40 to 95 °C) and moisture sensitivity level of 3.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,990 parts In-Stock

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Digiode

USA . 1,387 parts In-Stock

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Flip Electronics

USA . 702 parts In-Stock

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AZTECH Wire

Italy . 240 parts In-Stock

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$21.390

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$21.390

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SupplyDigital Components

Austria . 8,016 parts In-Stock

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TANS Electronics

Latvia . 7,208 parts In-Stock

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Kulean Microsystems

USA . 3,843 parts In-Stock

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Corphita

USA . 1,968 parts In-Stock

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Problanco Electronics

Mexico . 1,865 parts In-Stock

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Perfect Parts

USA . 1,021 parts In-Stock

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Microchip USA

USA . 356 parts In-Stock

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Corohmni

South Africa . 294 parts In-Stock

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Kepictronics

USA . 182 parts In-Stock

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UHIMA Technologies

Türkiye . 89 parts In-Stock

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Overview

Elevate your display experience with the LC75805PES-3H by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Graphics Display Drivers like no other. Whether you're looking to enhance your digital signage, automotive displays, or consumer electronics, this product offers unparalleled value and performance. With its advanced technology and reliable design, the LC75805PES-3H ensures smooth operation and crisp visuals every time. Upgrade your displays today and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Display Mode: SEGMENT

The segment display mode offers a simple and clear way to present information, making it easy to read for users.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Power Supplies (V): 5

Operating at 5V ensures compatibility with a wide range of devices and power sources, making it versatile for different applications.

No. of Terminals: 100

Having 100 terminals provides plenty of connection options for interfacing with other components, allowing for flexibility and customization.

Package Style (Meter): FLATPACK

The flatpack package style saves space and allows for efficient use of board real estate, making it suitable for compact designs.

Maximum Operating Temperature: 95 °C

With a maximum operating temperature of 95 °C, the product can withstand high temperature environments, ensuring reliability and longevity.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C enables the product to function in cold conditions without compromising performance, expanding its range of use.

Terminal Finish: TIN BISMUTH

The tin bismuth finish provides good solderability and corrosion resistance, ensuring a reliable connection and extended product lifespan.

Maximum Supply Current: 1.5 mA

Consuming only 1.5mA of current, the product is energy-efficient and suitable for battery-powered devices, enhancing portability.

Technical Specifications

Graphics Display Drivers LC75805PES-3H attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Backplanes:

4-BP

No. of Segments:

38

No. of Terminals:

100

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

1.5 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LC75805PES-3H Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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