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LC75805PEH-3H

Onsemi

LC75805PEH-3H by Onsemi

LC75805PEH-3H by Onsemi is a Graphics Display Driver with 38 segments, operating at 5V. It features a CMOS technology, GULL WING terminals, and PLASTIC/EPOXY package material. Ideal for Liquid Crystal Display applications in industrial settings due to its wide temperature range of -40 to 95 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,981 parts In-Stock

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Digiode

USA . 1,507 parts In-Stock

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AZTECH Wire

Italy . 184 parts In-Stock

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$13.090

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SupplyDigital Components

Austria . 6,860 parts In-Stock

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TANS Electronics

Latvia . 3,952 parts In-Stock

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Kulean Microsystems

USA . 3,911 parts In-Stock

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Problanco Electronics

Mexico . 2,594 parts In-Stock

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Corphita

USA . 2,229 parts In-Stock

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UHIMA Technologies

Türkiye . 505 parts In-Stock

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505

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Corohmni

South Africa . 366 parts In-Stock

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Microchip USA

USA . 183 parts In-Stock

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Overview

Elevate your display with the LC75805PEH-3H by Onsemi, a top-tier manufacturer known for quality and reliability. As a leading player in graphics display drivers, this product offers unmatched value with its advanced technology and industrial-grade components. From segment display modes to a wide range of applications, this driver is a game-changer for your projects. Experience the benefits of seamless integration, low power consumption, and high performance like never before. Upgrade to the LC75805PEH-3H today and watch your visuals come to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material makes the package lightweight and durable, protecting the internal components of the display driver.

Display Mode: SEGMENT

Segment display mode allows for clear and precise segment representation on the display, ideal for showing specific information or data.

Surface Mount: YES

Surface mount feature makes the installation process easier and more efficient, saving time and effort during assembly.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with most systems and devices, making it versatile for various applications.

No. of Terminals: 100

Having a high number of terminals enables a greater level of connectivity and functionality, allowing for more complex display configurations.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature, the display driver can withstand harsh environmental conditions without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable operation of the display driver.

Technical Specifications

Graphics Display Drivers LC75805PEH-3H attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Backplanes:

4-BP

No. of Segments:

38

No. of Terminals:

100

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

1.5 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LC75805PEH-3H Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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