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LC75809PT

Onsemi

LC75809PT by Onsemi

LC75809PT by Onsemi is a graphics display driver with 352 segments, operating at a max supply voltage of 6.3V and min of 4.5V. It features serial data input mode, suitable for industrial temperature grade applications in liquid crystal displays due to its CMOS technology and thin profile flatpack package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,645 parts In-Stock

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Vyrian

USA . 1,213 parts In-Stock

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1,213

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Distributors (Availability)

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Kulean Microsystems

USA . 5,533 parts In-Stock

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5,533

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SupplyDigital Components

Austria . 3,781 parts In-Stock

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TANS Electronics

Latvia . 3,281 parts In-Stock

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Corphita

USA . 2,398 parts In-Stock

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Problanco Electronics

Mexico . 2,173 parts In-Stock

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UHIMA Technologies

Türkiye . 684 parts In-Stock

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Corohmni

South Africa . 168 parts In-Stock

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Overview

Enhance your electronic displays with the LC75809PT by Onsemi, a top-quality Graphics Display Driver that offers unparalleled performance and reliability. Manufactured by Onsemi, a leader in semiconductor technology, this product is designed to deliver seamless data input through its serial interface, making it ideal for a wide range of applications. With a maximum supply voltage of 6.3V and a minimum operating temperature of -40 °C, this driver ensures optimal functionality in any environment. Upgrade your display systems today with the LC75809PT and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Display Mode: SEGMENT

Segment display mode offers clear and easy-to-read output, suitable for displaying numerical data or simple graphics.

Data Input Mode: SERIAL

Serial data input mode allows for easy and efficient communication with other devices, enhancing connectivity.

Surface Mount: YES

Being surface mountable makes installation and assembly of the product easier and more convenient.

Maximum Supply Voltage: 6.3 V

With a maximum supply voltage of 6.3V, it can handle higher power requirements and voltage inputs.

Package Shape: SQUARE

Square package shape provides a compact form factor, maximizing space efficiency in the design.

No. of Terminals: 100

Having 100 terminals allows for more connections and functionality, making it versatile for various applications.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style offers a sleek and modern design, improving aesthetics.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5V, it can operate efficiently even with lower power sources.

Maximum Operating Temperature: 85 °C

Being able to operate at temperatures up to 85 °C ensures reliability and performance in various environments.

Minimum Operating Temperature: -40 °C

Ability to operate at temperatures as low as -40 °C makes it suitable for use in extreme cold conditions.

Terminal Position: QUAD

Quad terminal position layout provides a secure and stable connection, reducing the risk of disconnection.

Maximum Seated Height: 1.2 mm

Having a maximum seated height of 1.2mm allows for a low-profile design, ideal for thin and sleek applications.

Width: 14 mm

The 14mm width ensures compatibility with standard mounting options and spacing requirements.

Length: 14 mm

The 14mm length provides a balanced form factor, making it easy to integrate into various designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand harsh environmental conditions and industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed, improving efficiency and performance.

Terminal Form: GULL WING

Gull wing terminal form provides a reliable solder connection, enhancing durability and longevity.

Maximum Supply Current: 2 mA

With a maximum supply current of 2mA, the product consumes low power, making it energy-efficient.

No. of Segments: 352

Having 352 segments allows for detailed and complex display output, suitable for advanced graphics and data visualization.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, it offers precise and compact connectivity, ideal for space-constrained designs.

Minimum fmax: 0.6 MHz

With a minimum fmax of 0.6MHz, it can handle high-frequency operations, ensuring fast and responsive performance.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

The Liquid Crystal Display Driver interface IC type ensures compatibility and seamless integration with LCD display panels.

Technical Specifications

Graphics Display Drivers LC75809PT attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

352

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

6.3 V

Minimum Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Minimum fmax:

.6 MHz

Trade Compliance

LC75809PT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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