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LC75809PT-H

Onsemi

LC75809PT-H by Onsemi

LC75809PT-H by Onsemi is a Graphics Display Driver with 352 segments, operating at -40 to 85 °C. It features a serial data input mode, 5V power supply, and quad terminal position. Ideal for liquid crystal display applications in industrial settings due to its thin profile and fine pitch package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,431 parts In-Stock

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2,431

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Digiode

USA . 2,182 parts In-Stock

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2,182

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,698 parts In-Stock

1+ parts

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7,698

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SupplyDigital Components

Austria . 5,830 parts In-Stock

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5,830

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Microchip USA

USA . 4,658 parts In-Stock

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4,658

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QUARKTWIN TECHNOLOGY LTD

USA . 3,959 parts In-Stock

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3,959

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Kulean Microsystems

USA . 3,661 parts In-Stock

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3,661

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Corphita

USA . 1,230 parts In-Stock

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1,230

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TANS Electronics

Latvia . 1,081 parts In-Stock

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1,081

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UHIMA Technologies

Türkiye . 910 parts In-Stock

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910

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Corohmni

South Africa . 471 parts In-Stock

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471

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Overview

Discover the innovative LC75809PT-H by Onsemi, a leading manufacturer in the field of Graphics Display Drivers. This cutting-edge product offers seamless display mode and data input mode for enhanced user experience. With a wide temperature range and advanced CMOS technology, this driver is perfect for industrial applications. Experience top-tier quality and reliability with Onsemi's LC75809PT-H, providing exceptional value and performance for all your graphic display needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications while providing protection to the internal components.

Display Mode: SEGMENT

Segment display offers clear and easy-to-read information, making it ideal for displaying numerical or alphabetical data in a simple and effective way.

Data Input Mode: SERIAL

Serial data input mode allows for efficient communication between devices, making the product easy to integrate into different systems.

Surface Mount: YES

Surface mount technology saves space, improves reliability, and enables automated assembly, making the product cost-effective and versatile.

Maximum Supply Voltage: 6.3 V

With a high maximum supply voltage, the product can handle varying input voltages, ensuring stable operation and protection against voltage spikes.

Package Shape: SQUARE

The square package shape allows for easy mounting and alignment, simplifying the integration of the product into different electronic systems.

Power Supplies (V): 5

The 5V power supply is a common and standard voltage level, making the product compatible with a wide range of electronic devices and systems.

No. of Terminals: 100

Having a high number of terminals allows for more connectivity options and flexibility in the design and implementation of the product.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style offers a compact form factor, making the product suitable for space-constrained applications and high-density designs.

No. of Backplanes: 4-BP

Having multiple backplanes provides redundancy and enhances the reliability of the product by ensuring continuous operation even if one backplane fails.

Minimum Supply Voltage: 4.5 V

With a low minimum supply voltage, the product can operate efficiently even in low-power scenarios, increasing its versatility and applicability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to function reliably in harsh environmental conditions, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can operate in cold environments without performance degradation, enhancing its reliability and durability.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish provides excellent solderability and resistance to corrosion, ensuring long-term reliability and stability of the product.

Terminal Position: QUAD

The quad terminal position offers enhanced connectivity options and facilitates easy integration of the product into different electronic systems and circuit designs.

Maximum Seated Height: 1.2 mm

The low maximum seated height allows for a slim profile and compact design, making the product suitable for thin and space-constrained applications.

Width: 14 mm

The compact width of the product enables it to be easily integrated into various electronic systems and devices without taking up too much space.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature ensures proper soldering and mounting of the product, resulting in reliable performance and durability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for efficient soldering and assembly processes, ensuring the product's longevity and reliability in different operating conditions.

Length: 14 mm

The compact length of the product makes it suitable for integration into small electronic devices and systems, offering flexibility in design and installation.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand harsh environmental conditions and temperature fluctuations, making it suitable for demanding industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance, making the product energy-efficient and suitable for various electronic applications.

Terminal Form: GULL WING

The gull wing terminal form provides easy soldering and assembly, enhancing the product's reliability and durability in different operating conditions.

Maximum Supply Current: 2 mA

With a low maximum supply current, the product consumes minimal power, making it energy-efficient and suitable for battery-operated devices and low-power applications.

No. of Segments: 352

Having a high number of segments allows for versatile display options, making the product ideal for displaying complex and detailed information in various applications.

Terminal Pitch: 0.5 mm

The small terminal pitch offers high-density connections and allows for compact design and integration of the product into space-constrained electronic systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product is sensitive to moisture and requires proper handling and storage, ensuring its reliability and preventing damage during assembly and operation.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

The interface IC type designed for liquid crystal display drivers offers compatibility with various display technologies, making the product versatile and suitable for different display applications.

Technical Specifications

Graphics Display Drivers LC75809PT-H attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e6

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Backplanes:

4-BP

No. of Functions:

1

No. of Segments:

352

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

6.3 V

Minimum Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

LC75809PT-H Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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