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FGY100T65SCDT

Onsemi

FGY100T65SCDT by Onsemi

FGY100T65SCDT by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 1.9V and a max IC of 200A. Ideal for GENERAL PURPOSE SWITCHING applications, it has a max operating temperature of 175 °C and a nominal turn off time of 410ns.

Median Price

$14.160

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 438 parts In-Stock

1+ parts

$10.410

100+ parts

$9.780

1k+ parts

$8.850

10k+ parts

-

438

$10.410

$9.780

$8.850

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Mouser Electronics

USA . 160 parts In-Stock

1+ parts

$14.160

100+ parts

$8.290

1k+ parts

-

10k+ parts

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160

$14.160

$8.290

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-

DigiKey

USA . 68 parts In-Stock

1+ parts

$14.160

100+ parts

$8.633

1k+ parts

$7.245

10k+ parts

-

68

$14.160

$8.633

$7.245

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 158 parts In-Stock

1+ parts

$7.980

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-

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158

$7.980

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Vyrian

USA . 11,350 parts In-Stock

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11,350

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Flip Electronics

USA . 2,250 parts In-Stock

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2,250

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Distributors (Availability)

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Corphita

USA . 1,667 parts In-Stock

1+ parts

$7.560

100+ parts

-

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1,667

$7.560

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Corohmni

South Africa . 236 parts In-Stock

1+ parts

$8.400

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236

$8.400

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Kulean Microsystems

USA . 6,762 parts In-Stock

1+ parts

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6,762

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TANS Electronics

Latvia . 6,282 parts In-Stock

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6,282

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Problanco Electronics

Mexico . 6,087 parts In-Stock

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6,087

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Northwest PG Solutions

USA . 1,621 parts In-Stock

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1,621

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Perfect Parts

USA . 1,268 parts In-Stock

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1,268

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iodParts Technologies Inc.

India . 1,268 parts In-Stock

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1,268

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UHIMA Technologies

Türkiye . 891 parts In-Stock

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891

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SupplyDigital Components

Austria . 388 parts In-Stock

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388

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Native Components

USA . 310 parts In-Stock

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310

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Overview

Unleash the power of innovation with Onsemi's FGY100T65SCDT Insulated Gate Bipolar Transistor. Designed for general purpose switching applications, this N-CHANNEL transistor offers unparalleled performance and reliability. With a maximum collector-emitter voltage of 650V and a maximum collector current of 200A, this transistor is ideal for high-power circuits. Its single configuration with built-in diode ensures ease of use and efficiency. Trust Onsemi's expertise in semiconductor manufacturing and elevate your projects to new heights with the FGY100T65SCDT. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

Efficient for switching applications and offers good performance for general purpose use.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor package.

Maximum VCEsat: 1.9 V

Low on-state voltage drop leads to energy efficiency and reduces power loss.

Package Shape: RECTANGULAR

Facilitates easy mounting and integration into various electronic devices.

Terminal Form: THROUGH-HOLE

Suitable for through-hole PCB assembly, ensuring secure and reliable connections.

Nominal Turn Off Time (toff): 410 ns

Fast turn-off time allows for swift switching transitions, improving overall performance.

Maximum Power Dissipation (Abs): 750 W

Capable of handling high power levels, making it suitable for demanding applications.

Maximum Operating Temperature: 175 °C

Can operate efficiently at high temperatures, increasing the overall reliability of the device.

Maximum Collector-Emitter Voltage: 650 V

Offers a high breakdown voltage, making it suitable for high voltage applications.

Maximum Gate-Emitter Voltage: 25 V

Provides sufficient headroom for gate control signals, ensuring proper functionality.

Maximum Collector Current (IC): 200 A

High collector current rating allows for handling large currents, suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 6.9 V

Optimal gate threshold voltage for reliable switching operation.

Terminal Finish: MATTE TIN

Provides a durable and corrosion-resistant finish for the terminals, ensuring long-term performance.

Terminal Position: SINGLE

Simplified terminal layout for easy connection and integration into circuits.

Case Connection: COLLECTOR

Convenient case connection for easy circuit configuration and mounting.

Nominal Turn On Time (ton): 240 ns

Fast turn-on time facilitates quick response and efficient switching operations.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGY100T65SCDT attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

FAST SWITCHING

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.9 V

Maximum Gate-Emitter Voltage:

25 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

GENERAL PURPOSE SWITCHING

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

410 ns

Nominal Turn On Time (ton):

240 ns

Maximum VCEsat:

1.9 V

Trade Compliance

FGY100T65SCDT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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